Micro-element, alignment system and assembling method
US-2024404864-A1 · Dec 5, 2024 · US
Dispositions of multiple connectors or interconnections
Dispositions of multiple connectors or interconnections · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/851 |
| Official title | {Dispositions of multiple connectors or interconnections} |
| Display label | Dispositions of multiple connectors or interconnections |
| Total patents | 2,972 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 90 |
| 2016 | 83 |
| 2017 | 97 |
| 2018 | 115 |
| 2019 | 167 |
| 2020 | 259 |
| 2021 | 201 |
| 2022 | 208 |
| 2023 | 335 |
| 2024 | 840 |
| 2025 | 378 |
| 2026 | 199 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Structure to reduce chip shift during assembly
US-2024395758-A1 · Nov 28, 2024 · US
Semiconductor package and method of manufacturing the semiconductor package
US-2024332150-A1 · Oct 3, 2024 · US
Packages with electrical fuses
US-2024332243-A1 · Oct 3, 2024 · US
Semiconductor package
US-2024297150-A1 · Sep 5, 2024 · US
Frame member with a porous material between a semiconductor module and heat sink
US-12068217-B2 · Aug 20, 2024 · US
Semiconductor substrate and manufacturing method thereof
US-2024274520-A1 · Aug 15, 2024 · US
Electronic package and manufacturing method thereof
US-2024274519-A1 · Aug 15, 2024 · US
Sensor packaging method and sensor package
US-2024222308-A1 · Jul 4, 2024 · US
Thermal expansion matched chip module with integrated liquid cooling
US-2024203822-A1 · Jun 20, 2024 · US
Integrated fan-out package and manufacturing method thereof
US-2024178120-A1 · May 30, 2024 · US
Connecting a chiplet to an interposer die and to a package interface using a spacer interconnect coupled to a portion of the chiplet
US-2024113004-A1 · Apr 4, 2024 · US
Package structure and method of manufacturing the same
US-2024105664-A1 · Mar 28, 2024 · US
Semiconductor structure, method of forming same, and memory
US-2024105706-A1 · Mar 28, 2024 · US
Tightly-coupled random access memory interface shim die
US-2024088084-A1 · Mar 14, 2024 · US
Semiconductor device
US-2024079290-A1 · Mar 7, 2024 · US
Semiconductor device
US-2024071862-A1 · Feb 29, 2024 · US
Semiconductor package with reinforcing structure
US-2024063077-A1 · Feb 22, 2024 · US
Semiconductor structure and manufacturing method thereof
US-2024063101-A1 · Feb 22, 2024 · US
Semiconductor apparatus
US-2024055355-A1 · Feb 15, 2024 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/851?
- CPC H10W72/851 is the Cooperative Patent Classification code for “Dispositions of multiple connectors or interconnections.”
- How many patents are filed under CPC H10W72/851 (Dispositions of multiple connectors or interconnections)?
- Our database includes 2,972 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/851 growing?
- Publication counts under this code: 840 in 2024 vs 378 in 2025 (latest complete years).