Integrated heat spreader with enhanced vapor chamber for multichip packages

Patent metadata

Field	Value
Publication number	US-12046536-B2
Application number	US-201916398452-A
Country	US
Kind code	B2
Filing date	Apr 30, 2019
Priority date	Apr 30, 2019
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

An integrated circuit package includes a first die and second die above a substrate, and a vapor chamber above at least one of the first and second die. A vapor space within the vapor chamber is separated into at least a first section and a second section. The first section may be over the first die, and the second section may be over the second die, for example. The structure separating the first and second sections at least partly restricts flow of vapor between the first and second sections, thereby preventing or reducing thermal cross talk between the first and second dies. In some cases, an anisotropic thermal material is above one of the first or second die, wherein the anisotropic thermal material has substantially higher thermal conductivity in a direction of a heat sink than a thermal conductivity in a direction of a section of the vapor chamber.

First claim

What is claimed is:

1. An integrated circuit package comprising:
a substrate;
a first die and a second die above the substrate;
a vapor chamber above the first die and the second die, the vapor chamber including a wicking material having an uppermost surface, a vapor space having a bottom above the uppermost surface of the wicking material, and a baffle that extends through the vapor space and that defines a first section of the vapor space and a second section of the vapor space, the baffle to at least partly restrict flow of vapor from the first section of the vapor space to the second section of the vapor space, wherein the baffle hangs from the vapor chamber and over the wicking material but does not extend into the wicking material, the baffle having a bottommost surface that does not extend through the wicking material, and wherein the wicking material is continuous across the first section of the vapor space and the second section of the vapor space and beneath the bottommost surface of the baffle; and
a heat sink over the vapor chamber, the heat sink extending laterally across an entirety of the vapor space of the vapor chamber.

2. The integrated circuit package of claim 1 , wherein the first section of the vapor space is above the first die, and the second section of the vapor space is above the second die.

3. The integrated circuit package of claim 1 , wherein: the vapor chamber has a bottom plate facing the first and second dies, a top plate opposite the bottom plate, and at least a first sidewall and an opposing second sidewall between the top and bottom plates; and the baffle extends from the top plate, and is between the first sidewall and the second sidewall.

4. The integrated circuit package of claim 3 , wherein: a first end of the baffle faces the first sidewall and an opposite second end of the baffle faces the second sidewall; and the first end of the baffle does not extend to the first sidewall, such that the first section of the vapor space and the second section of the vapor space are connected through a space between the first end of the baffle and the first sidewall.

5. The integrated circuit package of claim 3 , wherein: a first end of the baffle is attached to the first sidewall and an opposite second end of the baffle is attached to the second sidewall.

6. The integrated circuit package of claim 1 , wherein the baffle includes metal.

7. The integrated circuit package of claim 1 , further comprising: a third die above the substrate, wherein the vapor chamber includes another baffle that extends through the vapor space, the another baffle to at least partly restrict flow of vapor from the second section of the vapor space to a third section of the vapor space, and wherein the second section of the vapor space is above the second die, and the third section of the vapor space is above the third die.

8. The integrated circuit package of claim 1 , further comprising: a third die above the substrate, wherein the first section of the vapor space is above the first die and the third die, and the second section of the vapor space is above the second die.

9. The integrated circuit package of claim 1 , wherein the vapor chamber is within a heat spreader structure that is thermally coupled to the first and second die.

10. An integrated circuit package comprising:
a substrate;
a first die and a second die above the substrate;
a vapor chamber above the first die;
an anisotropic thermal material above the second die; and
a heat sink above one or both of the vapor chamber and the anisotropic thermal material;
wherein the anisotropic thermal material has substantially higher thermal conductivity in a direction of the heat sink than a thermal conductivity in a direction of at least a section of the vapor chamber.

11. The integrated circuit package of claim 10 , wherein the anisotropic thermal material has thermal conductivity of at least 1500 W/m-° K in the direction of the heat sink, and a thermal conductivity of at most 15 W/m-° K in the direction of the vapor chamber, and wherein the anisotropic thermal material comprises Pyrolytic Graphite material.

12. The integrated circuit package of claim 10 , wherein the anisotropic thermal material comprises parallel sheets of hexagonal arrays carbon atoms, and wherein the direction of the heat sink is along a length of the parallel sheets, and the direction of at least the section of the vapor chamber is perpendicular to a plane of the parallel sheets.

13. The integrated circuit package of claim 10 , wherein: at least the section of the vapor chamber is a first section of the vapor chamber; and the anisotropic thermal material has substantially higher thermal conductivity in a direction of a second section of the vapor chamber; the first section of the vapor chamber is above the first die; and the second section of the vapor chamber is not above any die.

14. The integrated circuit package of claim 13 , further comprising: a third die, wherein the anisotropic thermal material has substantially higher thermal conductivity in the direction of the heat sink than a thermal conductivity in a direction of a third section of the vapor chamber, and wherein the third section of the vapor chamber is above the third die.

15. The integrated circuit package of claim 10 , wherein the vapor chamber has an opening, and the anisotropic thermal material is within the opening in the vapor chamber.

16. An apparatus comprising:
a substrate;
a first die and a second die above the substrate;
a vapor chamber including a first section with a first vapor space above the first die, a second section with a second vapor space above the second die, a baffle to at least partly separate the first section from the second section, and a wicking material, wherein a bottom of the first vapor space and the second vapor space is above an uppermost surface of the wicking material, wherein the baffle hangs from the vapor chamber and over the wicking material but does not extend into the wicking material, the baffle having a bottommost surface that does not extend through the wicking material, and wherein the wicking material is continuous across the first section of the vapor space and the second section of the vapor space and beneath the bottommost surface of the baffle; and
a heat sink over the vapor chamber, the heat sink extending laterally across an entirety of the first vapor space and the second vapor space of the vapor chamber.

Assignees

• Intel Corp

Inventors

• Chang Je-Young
• Matayabas Jr James C
• Wan Zhimin
• Arrington Kyle

Classifications

• H10W40/257

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• H10W40/22 Primary

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title