Sensor package and manufacturing method thereof
US-2024321658-A1 · Sep 26, 2024 · US
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Patent family 57452011
This patent family groups 13 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57452011 |
| Family type | — |
| Earliest priority | Jun 4, 2015 |
| First filing country | US |
| Member publications | 13 |
| Countries | US |
| Representative publication | US2024321658A1 — Sensor package and manufacturing method thereof |
Representative publication
Best representative member for this family based on priority and filing country.
US2024321658A1 — Sensor package and manufacturing method thereof (published Sep 26, 2024)
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