Fingerprint sensor and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9984947-B2
Application number	US-201715670589-A
Country	US
Kind code	B2
Filing date	Aug 7, 2017
Priority date	Jun 4, 2015
Publication date	May 29, 2018
Grant date	May 29, 2018

Abstract

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

First claim

What is claimed is:

1. A sensor device comprising:
a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides, the substrate comprising a conductive layer on the top substrate side;
a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, the semiconductor die comprising a conductive pad on the top die side;
a conductive interconnection structure electrically connecting the conductive pad to the conductive layer;
a dielectric layer (DL) having a top DL side, a bottom DL side coupled to the top die side, and lateral DL sides between the top and bottom DL sides;
a plate positioned over a sensing area of the semiconductor die, the plate having a top plate side, a bottom plate side coupled to the top DL side, and lateral plate sides between the top and bottom plate sides, wherein the center of the plate is laterally offset from the center of the semiconductor die; and
an encapsulating material covering at least the top substrate side, the lateral die sides, and the conductive interconnection structure.

2. The sensor device of claim 1 , wherein the dielectric layer comprises a preformed sheet applied to the semiconductor die and/or the plate.

3. The sensor device of claim 1 , wherein the dielectric layer comprises an adhesive that adheres the bottom plate side to the top die side.

4. The sensor device of claim 1 , wherein the dielectric layer is transparent.

5. The sensor device of claim 1 , wherein at least one, but not all, of the lateral die sides is substantially coplanar with a respective one of the lateral DL sides and with a respective one of the lateral plate sides.

6. The sensor device of claim 1 , wherein the conductive interconnection structure comprises a bond wire, and the encapsulating material contacts and surrounds the entire bond wire.

7. The sensor device of claim 1 , wherein the encapsulating material covers the lateral DL sides and the lateral plate sides.

8. The sensor device of claim 1 , wherein the encapsulating material covers only a portion of the top die side that is not covered by the plate.

9. The sensor device of claim 1 , wherein the top plate side is substantially coplanar with a top side of the encapsulating material.

10. The sensor device of claim 1 , wherein the semiconductor die comprises fingerprint sensing circuitry.

11. A method of manufacturing a sensor device, the method comprising:
providing a structure comprising:
a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides, the substrate comprising a conductive layer on the top substrate side;
a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, the semiconductor die comprising a conductive pad on the top die side;
a conductive interconnection structure electrically connecting the conductive pad to the conductive layer; and
an encapsulating material covering the top substrate side, the lateral die sides, and the conductive interconnection structure;

forming a dielectric layer (DL) having a top DL side, a bottom DL side coupled to the top die side, and lateral DL sides between the top and bottom DL sides; and
mounting a plate positioned over a sensing area of the semiconductor die, the plate having a top plate side, a bottom plate side coupled to the top DL side, and lateral plate sides between the top and bottom plate side, wherein said mounting the plate comprises mounting the plate such that the center of the plate is laterally offset from the center of the semiconductor die.

12. The method of claim 11 , wherein the encapsulating material covers only a portion of the top die side that is not covered by the plate.

13. The method of claim 11 , wherein the dielectric layer is directly coupled to the encapsulating material.

Assignees

• Amkor Technology Inc

Inventors

• Chung Ji Young
• Park Dong Joo
• Kim Jin Seong
• Park Jae Sung
• Hong Se Hwan

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title