Sensor package and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12002725-B2
Application number	US-202318199215-A
Country	US
Kind code	B2
Filing date	May 18, 2023
Priority date	Jun 4, 2015
Publication date	Jun 4, 2024
Grant date	Jun 4, 2024

Abstract

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

First claim

What is claimed is:

1. A sensor device comprising:
a substrate having a top substrate side, a bottom substrate side, and a lateral substrate side, the substrate comprising a conductive layer on the top substrate side;
an electronic component comprising a top component side, a bottom component side coupled to the top substrate side, and a lateral component side, the electronic component comprising a sensing area on the top component side;
a conductive interconnection structure electrically connecting the electronic component to the conductive layer of the substrate;
an encapsulating material on the top substrate side and laterally surrounding the electronic component, the encapsulating material comprising a top encapsulating material side, a bottom encapsulating material side coupled to the top substrate side, and a lateral encapsulating material side;
a dielectric layer (DL) coupled to the encapsulating material and comprising a top DL side, a bottom DL side, and a lateral DL side; and
a plate positioned over the sensing area of the electronic component, the plate comprising a top plate side, a bottom plate side coupled to the top DL side, and a lateral plate side.

2. The sensor device of claim 1 , wherein:
the electronic component comprises a conductive pad on the top component side; and
the plate is positioned over the conductive pad of the electronic component.

3. The sensor device of claim 1 , wherein the electronic component comprises a semiconductor die.

4. The sensor device of claim 1 , wherein the bottom component side of the electronic component is directly coupled to the top substrate side.

5. The sensor device of claim 1 , wherein the plate is directly vertically above at a majority of the conductive interconnection structure.

6. The sensor device of claim 1 , wherein the encapsulating material laterally surrounds an entirety of the conductive interconnection structure.

7. The sensor device of claim 6 , wherein the encapsulating material directly contacts the conductive interconnection structure.

8. The sensor device of claim 1 , wherein:
the top encapsulating material side is vertically higher than an uppermost part of the conductive interconnection structure; and
the bottom encapsulating material side is vertically lower than a lowermost part of the conductive interconnection structure.

9. The sensor device of claim 1 , wherein the plate is laterally wider than the electronic component.

10. The sensor device of claim 1 , wherein the dielectric layer (DL) directly contacts the electronic component.

11. A sensor device comprising:
a substrate comprising a top substrate side, a bottom substrate side, and a lateral substrate side, the substrate comprising a conductive layer on the top substrate side;
an electronic component having a top component side, a bottom component side coupled to the top substrate side, and a lateral component side, the electronic component comprising a sensing area on the top component side;
a conductive interconnection structure electrically connecting the electronic component to the conductive layer of the substrate;
an encapsulating material on the top substrate side and laterally surrounding the electronic component, the encapsulating material comprising a top encapsulating material side, a bottom encapsulating material side coupled to the top substrate side, and a lateral encapsulating material side; and
a plate positioned over the sensing area of the electronic component and over an entirety of the conductive interconnection structure, the plate comprising a top plate side, a bottom plate side, and a lateral plate side.

12. The sensor device of claim 11 , wherein:
the electronic component comprises a conductive pad on the top component side; and
the plate is positioned over the conductive pad of the electronic component.

13. The sensor device of claim 11 , wherein the electronic component comprises a semiconductor die.

14. The sensor device of claim 11 , wherein the bottom component side of the electronic component is directly coupled to the top substrate side.

15. The sensor device of claim 11 , further comprising a dielectric layer (DL) coupled to the encapsulating material, the DL comprising a top DL side, a bottom DL side, and a lateral DL side, wherein the top DL side is coupled to the bottom plate side.

16. The sensor device of claim 15 , wherein the dielectric layer (DL) covers an entirety of the top encapsulating material side.

17. The sensor device of claim 15 , wherein the lateral substrate side, the lateral encapsulating material side, the lateral plate side, and the lateral DL side are coplanar.

18. The sensor device of claim 11 , wherein the lateral substrate side, the lateral encapsulating material side, and the lateral plate side are coplanar.

19. The sensor device of claim 11 , wherein the encapsulating material directly contacts the lateral component side.

20. The sensor device of claim 11 , wherein the plate vertically covers an entirety of the substrate, an entirety of the electronic component, and an entirety of the encapsulating material.

21. The sensor device of claim 11 , wherein the encapsulating material laterally surrounds an entirety of the conductive interconnection structure.

22. The sensor device of claim 11 , wherein:
the top encapsulating material side is vertically higher than an uppermost part of the conductive interconnection structure; and
the bottom encapsulating material side is vertically lower than a lowermost part of the conductive interconnection structure.

23. A method of manufacturing a sensor device, the method comprising:
receiving a first structure comprising:
a substrate having a top substrate side, a bottom substrate side, and a lateral substrate side, the substrate comprising a conductive layer on the top substrate side;
an electronic component comprising a top component side, a bottom component side coupled to the top substrate side, and a lateral component side, the electronic component comprising a sensing area on the top component side; and
a conductive interconnection structure electrically connecting the electronic component to the conductive layer of the substrate;

positioning a plate over the sensing area of the electronic component, the plate comprising a top plate side, a bottom plate side, and a lateral plate side; and
providing an encapsulating material on the top substrate side and laterally surrounding the electronic component, the encapsulating material comprising a top encapsulating material side, a bottom encapsulating material side coupled to the top substrate side, and a lateral encapsulating material side.

24. The method of claim 23 , wherein:
the electronic component comprises a conductive pad on the top component side; and
said forming the sensor device comprises positioning the plate over the conductive pad of the electronic component.

25. The method of claim 23 , wherein the electronic component comprises a semiconductor die.

26. The method of claim 23 , wherein the bottom component side of the electronic component is directly coupled to the top substrate side.

27. The method of claim 23 , wherein said positioning the plate is over an entirety of the sensing area of the electronic component and over an entirety of the conductive interconnection structure.

28. The method of claim 23 , wherein:
the top encap

Assignees

• Amkor Tech Singapore Holding Pte Ltd

Inventors

• Chung Ji Young
• Park Dong Joo
• Kim Jin Seong
• Park Jae Sung
• Hong Se Hwan

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title