Fingerprint sensor and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9728476-B2
Application number	US-201615144565-A
Country	US
Kind code	B2
Filing date	May 2, 2016
Priority date	Jun 4, 2015
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

First claim

What is claimed is:

1. A fingerprint sensor device comprising:
a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides, the substrate comprising a conductive pattern on the top substrate side;
a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, where the top die side comprises an uppermost planar side of the semiconductor die and the semiconductor die comprises a bond pad on the top die side;
a bond wire electrically connecting the bond pad and the conductive pattern;
an encapsulating material surrounding the lateral die sides and having a top encapsulant side, a bottom encapsulant side, and lateral encapsulant sides between the top and bottom encapsulant sides;
a dielectric layer (DL) having a top DL side, a bottom DL side coupled to the top die side, and lateral DL sides between the top and bottom DL sides; and
a plate through which a fingerprint is sensed, the plate having a top plate side, a bottom plate side coupled to the top DL side, and lateral plate sides between the top and bottom plate sides, where the plate is positioned over only a portion of the top die side that is laterally offset from the bond pad.

2. The fingerprint sensor device of claim 1 , wherein the plate comprises a glass. lateral DL sides and the lateral plate sides.

3. The fingerprint sensor device of claim 1 , wherein the dielectric layer is formed of a different material than the encapsulating material.

4. The fingerprint sensor device of claim 1 , wherein the dielectric layer comprises a preformed sheet.

5. The fingerprint sensor device of claim 1 , wherein the dielectric layer comprises an adhesive layer that adheres the bottom plate side to the top die side.

6. The fingerprint sensor device of claim 1 , wherein the encapsulating material covers only a portion of the top die side that is not covered by the plate.

7. The fingerprint sensor device of claim 1 , wherein the encapsulating material covers the lateral DL sides and the lateral plate sides.

Assignees

• Amkor Technology Inc

Inventors

• Chung Ji Young
• Park Dong Joo
• Kim Jin Seong
• Park Jae Sung
• Hong Se Hwan

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title