Electronic package module and method for fabrication of the same
US-2024413067-A1 · Dec 12, 2024 · US
Sensor package and manufacturing method thereof
US2020294875A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020294875-A1 |
| Application number | US-202016890027-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 2, 2020 |
| Priority date | Jun 4, 2015 |
| Publication date | Sep 17, 2020 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
First claim
Opening claim text (preview).
1 . A fingerprint sensor device comprising: a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides, the substrate comprising a conductive layer on the top substrate side; a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, the semiconductor die comprising a bond pad on the top die side; a conductive interconnection structure electrically connecting the bond pad and the conductive pattern; a dielectric layer (DL) having a top DL side, a bottom DL side coupled to the top die side, and lateral DL sides between the top and bottom DL sides; and an encapsulating material covering the top substrate side, the lateral die sides, and the conductive interconnection structure. 2 - 20 . (canceled)
Assignees
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Classifications
Encapsulations, e.g. protective coatings · CPC title
batch processes · CPC title
of die-attach connectors · CPC title
Die-attach connectors and bond wires · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
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Frequently asked questions
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- What does patent US2020294875A1 cover?
- A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that compri…
- Who is the assignee on this patent?
- Amkor Technology Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W74/114. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Sep 17 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).