Multi-chip package and method of providing die-to-die interconnects in same
US-2024429173-A1 · Dec 26, 2024 · US
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Patent family 43379778
This patent family groups 14 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 43379778 |
| Family type | — |
| Earliest priority | Jun 24, 2009 |
| First filing country | US |
| Member publications | 14 |
| Countries | US |
| Representative publication | US2024429173A1 — Multi-chip package and method of providing die-to-die interconnects in same |
Representative publication
Best representative member for this family based on priority and filing country.
US2024429173A1 — Multi-chip package and method of providing die-to-die interconnects in same (published Dec 26, 2024)
Member publications
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