Barrier layer on a piezoelectric-device pad
US-2024314500-A1 · Sep 19, 2024 · US
Fillings including materials for absorbing or reacting with moisture or other undesired substances
Fillings including materials for absorbing or reacting with moisture or other undesired substances · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W76/48 |
| Official title | Fillings including materials for absorbing or reacting with moisture or other undesired substances |
| Display label | Fillings including materials for absorbing or reacting with moisture or other undesired substances |
| Total patents | 307 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 32 |
| 2016 | 41 |
| 2017 | 41 |
| 2018 | 17 |
| 2019 | 25 |
| 2020 | 25 |
| 2021 | 23 |
| 2022 | 27 |
| 2023 | 22 |
| 2024 | 26 |
| 2025 | 24 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Wafer level package solder barrier used as vacuum getter
US-9520332-B2 · Dec 13, 2016 · US
Semiconductor device and manufacturing method of the same
US-2016343630-A1 · Nov 24, 2016 · US
Integrated circuit with hydrogen absorption structure
US-2016315091-A1 · Oct 27, 2016 · US
Dispensable polymeric precursor composition for transparent composite sorber materials
US-9475033-B2 · Oct 25, 2016 · US
Encapsulated arrays of electronic switching devices
US-9460976-B2 · Oct 4, 2016 · US
Fingerprint sensing device with protective coating
US-9449214-B2 · Sep 20, 2016 · US
Integrated circuit carrier coating
US-9431313-B1 · Aug 30, 2016 · US
Integrated circuit carrier coating
US-2016247738-A1 · Aug 25, 2016 · US
Bonded system and a method for adhesively bonding a hygroscopic material
US-2016247739-A1 · Aug 25, 2016 · US
Semiconductor device, related manufacturing method, and related electronic device
US-9425068-B2 · Aug 23, 2016 · US
Electronic component having a corrosion-protected bonding connection and method for producing the component
US-9425118-B2 · Aug 23, 2016 · US
Method, system, and apparatus for preparing substrates and bonding semiconductor layers to substrates
US-9390942-B2 · Jul 12, 2016 · US
Getter composition
US-2016175805-A1 · Jun 23, 2016 · US
Trench metal-insulator-metal capacitor with oxygen gettering layer
US-2016181353-A1 · Jun 23, 2016 · US
Semiconductor device, related manufacturing method, and related electronic device
US-9352957-B2 · May 31, 2016 · US
Devices including, methods using, and compositions of reflowable getters
US-9318724-B2 · Apr 19, 2016 · US
Moisture scavenging layer for thinner barrier application in beol integration
US-9318437-B1 · Apr 19, 2016 · US
Method of improving getter efficiency by increasing superficial area
US-2016101976-A1 · Apr 14, 2016 · US
Method to fabricate a substrate including a material disposed on the edge of one or more non through hole formed in the substrate
US-9277656-B2 · Mar 1, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W76/48?
- CPC H10W76/48 is the Cooperative Patent Classification code for “Fillings including materials for absorbing or reacting with moisture or other undesired substances.”
- How many patents are filed under CPC H10W76/48 (Fillings including materials for absorbing or reacting with moisture or other undesired substances)?
- Our database includes 307 publications tagged with this CPC code.
- Is patent activity under CPC H10W76/48 growing?
- Publication counts under this code: 26 in 2024 vs 24 in 2025 (latest complete years).