Electronic component having a corrosion-protected bonding connection and method for producing the component

Patent metadata

Field	Value
Publication number	US-9425118-B2
Application number	US-201214370858-A
Country	US
Kind code	B2
Filing date	Nov 29, 2012
Priority date	Jan 11, 2012
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

The invention relates to an electronic component ( 1 ) having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component ( 1 ) has at least one semiconductor chip ( 3 ) on a substrate ( 4 ). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip ( 3 ). For encapsulation of the at least one semiconductor chip ( 3 ) and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing ( 5 ). The hermetically sealed bonding connection is a bonding wire connection ( 2 ) which is fully enclosed in the housing ( 5 ), in which the substrate ( 4 ) is at least partially enclosed. The substrate ( 4 ) has at least one surface-mounted hydrolysis-sensitive component ( 6 ) in the housing ( 5 ).

First claim

The invention claimed is:

1. An electronic component having a corrosion-protected bonding connection, comprising:
at least one semiconductor chip ( 3 ) on a substrate ( 4 );
at least one bonding connection at risk of corrosion on the semiconductor chip ( 3 ); and
a package ( 5 ) hermetically enclosing the at least one semiconductor chip ( 3 ) and the at least one bonding connection at risk of corrosion,
the bonding connection being a bonding wire connection ( 2 ), and the bonding wire connection ( 2 ) being completely hermetically enclosed in the package ( 5 ) and the substrate ( 4 ) being at least partially hermetically enclosed in the package ( 5 ), and at least one surface-mountable hydrolysis-sensitive component ( 6 ) being arranged on the substrate ( 4 ); wherein the hydrolysis-sensitive component ( 6 ) comprises a hydrolysis-sensitive core material ( 11 ), the core material ( 11 ) being able to getter water molecules of an atmosphere of an interior space ( 12 ) of the package ( 5 ); the core material ( 11 ) of the hydrolysis-sensitive component ( 6 ) having a semipermeable coating at least on an upper side ( 7 ) and a peripheral surface ( 9 ) of the hydrolysis-sensitive component ( 6 ), and the semipermeable coating supporting the form of the hydrolysis-sensitive component ( 6 ) during saponification and loss of form and is permeable to water molecules.

2. The electronic component as claimed in claim 1 , the hydrolysis-sensitive component ( 6 ) having the upper side ( 7 ), an underside ( 8 ) and the peripheral surface ( 9 ) arranged between the upper side ( 7 ) and the underside ( 8 ), and the underside ( 8 ) of the hydrolysis-sensitive component ( 6 ) having a surface-mountable molecular layer ( 10 ).

3. The electronic component as claimed in claim 1 , the hydrolysis-sensitive component ( 6 ) comprising a hydrolysis-sensitive plastic.

4. The electronic component as claimed in claim 3 , the plastic comprising a hydrolysis-sensitive polymer, which in its hydrolysis extracts water molecules from the interior space ( 12 ) of the package ( 5 ).

5. The electronic component as claimed in claim 3 , the hydrolysis-sensitive plastic being exposed to intensive saponification by hydrolysis when a glass transition temperature of the plastic is exceeded.

6. The electronic component as claimed in claim 3 , the plastic being a hydrolysis-sensitive polyester.

7. The electronic component as claimed in claim 3 , the plastic being a hydrolysis-sensitive polybutylene terephthalate.

8. A method for producing an electronic component ( 1 ) as claimed in claim 1 , which comprises the following method steps:
producing at least one semiconductor chip ( 3 );
applying the at least one semiconductor chip ( 3 ) to a substrate ( 4 );
establishing at least one bonding wire connection ( 2 ) between the at least one semiconductor chip ( 3 ) and the substrate ( 4 );
surface-mounting at least one component ( 6 ) with a hydrolysis-sensitive material on the substrate ( 4 );
hermetically encapsulating the at least one semiconductor chip ( 3 ), the at least one bonding wire connection ( 2 ), the at least one component ( 6 ) with the hydrolysis-sensitive material and at least partially the substrate ( 4 ) in a package ( 5 ); and heat-treating the electronic component ( 1 ) at a temperature above a glass transition temperature of the hydrolysis-sensitive material, with gettering of water molecules of an atmosphere of an interior space ( 12 ) of the package ( 5 ); wherein the hydrolysis-sensitive component ( 6 ) comprises a hydrolysis-sensitive core material ( 11 ), the core material ( 11 ) of the hydrolysis-sensitive component ( 6 ) having a semipermeable coating at least on the upper side ( 7 ) and the peripheral surface ( 9 ) of the hydrolysis-sensitive component ( 6 ), and the semipermeable coating supporting the form of the hydrolysis-sensitive component ( 6 ) during saponification and loss of form and is permeable to water molecules.

Assignees

• Bosch Gmbh Robert

Inventors

• Bez Fabian
• Duerr Johannes
• Becker Rolf
• Lamers Sven
• Mueller Lutz
• Schlecht Michael

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07555

  changes in materials · CPC title

• H10W72/07532

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/5528

  Intermetallic compounds · CPC title

• H10W72/5524

  comprising aluminium [Al] · CPC title