Integrated power module packaging structure
US-9848518-B2 · Dec 19, 2017 · US
having other interconnections perpendicular to the conductive base
having other interconnections perpendicular to the conductive base · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W76/136 |
| Official title | having other interconnections perpendicular to the conductive base |
| Display label | having other interconnections perpendicular to the conductive base |
| Total patents | 297 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 25 |
| 2016 | 24 |
| 2017 | 25 |
| 2018 | 21 |
| 2019 | 27 |
| 2020 | 24 |
| 2021 | 37 |
| 2022 | 32 |
| 2023 | 39 |
| 2024 | 14 |
| 2025 | 24 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Power semiconductor module
US-9812431-B2 · Nov 7, 2017 · US
Semiconductor device and method of manufacturing semiconductor device
US-2017271273-A1 · Sep 21, 2017 · US
Semiconductor device
US-2017263587-A1 · Sep 14, 2017 · US
Power semiconductor module and composite module
US-9761567-B2 · Sep 12, 2017 · US
Semiconductor device and manufacturing method
US-2017236819-A1 · Aug 17, 2017 · US
Power semiconductor module having a pressure application body and arrangement therewith
US-2017221785-A1 · Aug 3, 2017 · US
Semiconductor device, method for installing heat dissipation member to semiconductor device, and a method for producing semiconductor device
US-9711430-B2 · Jul 18, 2017 · US
Semiconductor module
US-2017141012-A1 · May 18, 2017 · US
Semiconductor device
US-9589867-B2 · Mar 7, 2017 · US
Semiconductor device, intelligent power module and power conversion apparatus
US-2017063071-A1 · Mar 2, 2017 · US
Semiconductor module and semiconductor device
US-9524919-B2 · Dec 20, 2016 · US
Power module
US-9521737-B2 · Dec 13, 2016 · US
Power semiconductor module
US-2016358895-A1 · Dec 8, 2016 · US
Semiconductor device module with solder layer
US-9508700-B2 · Nov 29, 2016 · US
Power semiconductor module
US-2016307817-A1 · Oct 20, 2016 · US
Laser welding method
US-2016288259-A1 · Oct 6, 2016 · US
Semiconductor module and semiconductor device
US-2016293517-A1 · Oct 6, 2016 · US
All-in-one power semiconductor module
US-9455207-B2 · Sep 27, 2016 · US
Semiconductor Package Having a Multi-Layered Base
US-2016254203-A1 · Sep 1, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W76/136?
- CPC H10W76/136 is the Cooperative Patent Classification code for “having other interconnections perpendicular to the conductive base.”
- How many patents are filed under CPC H10W76/136 (having other interconnections perpendicular to the conductive base)?
- Our database includes 297 publications tagged with this CPC code.
- Is patent activity under CPC H10W76/136 growing?
- Publication counts under this code: 14 in 2024 vs 24 in 2025 (latest complete years).