Semiconductor module

Patent metadata

Field	Value
Publication number	US-2017141012-A1
Application number	US-201615281124-A
Country	US
Kind code	A1
Filing date	Sep 30, 2016
Priority date	Nov 18, 2015
Publication date	May 18, 2017
Grant date	—

Abstract

A semiconductor module includes case that houses a semiconductor device therein and a fastener that is connected at one end thereof to the case. The fastener includes a first extending portion that is connected at one end hereof to the case and extends away from the case, and a second extending portion that is connected at one end thereof to the first extending portion and extends toward the case, where the second extending portion has a variable angle with respect to the first extending portion depending on an external force. The second extending portion has a through hole penetrating through the second extending portion from a front surface of the second extending portion to a back surface of the second extending portion; and
a projection that is provided on the back surface of the second extending portion, the projection being positioned closer to the case than the through hole is.

First claim

1 . A semiconductor module comprising:
a case that houses a semiconductor device therein; and a fastener that is connected at one end thereof to the case, wherein the fastener includes: a first extending portion that is connected at one end thereof to the case and extends away from the case; and a second extending portion that is connected at one end thereof to the first extending portion and extends toward the case, the second extending portion having a variable angle with respect to the first extending portion depending on an external force, and the second extending portion has: a through hole that penetrates through the second extending portion from a front surface of the second extending portion to a back surface of the second extending portion; and a projection that is provided on the back surface of the second extending portion, the projection being positioned closer to the case than the through hole is.

2 . The semiconductor module as set forth in claim 1 , wherein
the fastener is provided on each of side surfaces of the case that oppose each other.

3 . The semiconductor module as set forth in claim 1 , wherein
the through hole is spaced away from the projection.

4 . The semiconductor module as set forth in claim 1 , wherein
a case-side end of the second extending portion that is the closest to the case is a free end, and the projection is provided on the case-side end of the second extending portion.

5 . The semiconductor module as set forth in claim 1 , wherein
the fastener has the first extending portion at each side of the second extending portion, and an outer end of the second extending portion that is the most distant from the case is connected to an outer end of the first extending portion at each side of the second extending portion.

6 . The semiconductor module as set forth in claim 5 , wherein
the fastener further has a reinforcing portion at a connecting portion between the first extending portion and the second extending portion, and the reinforcing portion has a larger thickness than other portions of the fastener.

7 . The semiconductor module as set forth in claim 6 , wherein
the reinforcing portion is provided at least in a partial region of the outer end of the first extending portion and not provided at least in a partial region of the outer end of the second extending portion.

8 . The semiconductor module as set forth in claim 1 , wherein
a back surface of the fastener is positioned between a front surface of the case and a back surface of the case.

9 . The semiconductor module as set forth in claim 8 , wherein
a tip of the projection is positioned between the front surface of the case and the back surface of the case.

10 . The semiconductor module as set forth in claim 1 , wherein
the first extending portion is wider than the second extending portion.

11 . The semiconductor module as set forth in claim 1 , wherein
the first extending portion has a larger thickness than the second extending portion.

12 . The semiconductor module as set forth in claim 1 , further comprising:
a heat sink that has the case placed thereon; and a fixation element that penetrates through the through hole of the second extending portion and secures the second extending portion onto the heat sink.

Assignees

• Fuji Electric Co Ltd

Inventors

• Hayashi Hideki

Classifications

• H10W76/136

  having other interconnections perpendicular to the conductive base · CPC title

• H10W40/235

  attached to package parts · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W76/10

  Containers or parts thereof · CPC title

• H10W40/611 Primary

  Bolts or screws · CPC title