Semiconductor device

Patent metadata

Field	Value
Publication number	US-9589867-B2
Application number	US-201514879682-A
Country	US
Kind code	B2
Filing date	Oct 9, 2015
Priority date	Oct 30, 2014
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

A semiconductor device includes: a semiconductor element having a gate and source electrodes; an insulating substrate which is provided with an insulating plate, a first circuit plate and a second circuit plate, the first circuit plate provided in a main surface of the insulating plate to be electrically connected to the gate electrode, the second circuit plate provided in the main surface to surround the first circuit plate and to be electrically connected to the source electrode; a first terminal, being column-shaped and electrically and mechanically connected to the first circuit plate; and a second terminal which is provided with a cylindrical body portion and support portions, the body portion has a through hole into which the first terminal is inserted with a gap, the support portions disposed in end portions of the body portion and electrically and mechanically connected to the second circuit plate.

First claim

What is claimed is:

1. A semiconductor device comprising:
a semiconductor element including a gate electrode and a source electrode in its front surface;
an insulating substrate including
an insulating plate,
a first circuit plate provided on a main surface of the insulating plate and electrically connected to the gate electrode, and
a second circuit plate provided on the main surface, surrounding the first circuit plate, and electrically connected to the source electrode;

a first terminal, being column-shaped and electrically and mechanically connected to the first circuit plate; and
a second terminal including
a cylindrical body portion having a through hole into which the first terminal is inserted with a gap between the first terminal and the body portion, and
a support portion disposed in an end portion of the body portion and electrically and mechanically connected to the second circuit plate.

2. The semiconductor device according to claim 1 , wherein
the semiconductor element further includes a drain electrode in its back surface, and
the semiconductor device further comprises a metal substrate electrically and mechanically connected to the drain electrode of the semiconductor element and fixed to the insulating substrate.

3. The semiconductor device according to claim 2 , wherein the metal substrate is an external terminal configured to receive an input.

4. The semiconductor device according to claim 1 , wherein the second terminal further includes at least one notch portion in the support portion, each of the at least one notch portion disposed to stride over the first circuit plate.

5. The semiconductor device according to claim 4 , wherein the at least one notch portion is a plurality of notch portions, each of the plurality of notch portions disposed in the support portion to be opposed to another of the plurality of notch portions.

6. The semiconductor device according to claim 1 , wherein the gap between the first terminal and an inner wall of the through hole of the second terminal is from 0.5 mm to 1 mm.

7. The semiconductor device according to claim 6 , wherein the gap is filled with a sealing resin.

8. The semiconductor device according to claim 1 , wherein
the first terminal has a circular column shape, and
the body portion of the second terminal has a circular cylindrical shape.

9. The semiconductor device according to claim 8 , wherein the section of the body portion perpendicular to an extending direction of the body portion has a diameter that is gradually larger toward the support portion.

Assignees

• Fuji Electric Co Ltd

Inventors

• Inaba Tetsuya

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W76/136

  having other interconnections perpendicular to the conductive base · CPC title

• H10W76/47

  Solid or gel fillings · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title