Semiconductor device, method for installing heat dissipation member to semiconductor device, and a method for producing semiconductor device

Patent metadata

Field	Value
Publication number	US-9711430-B2
Application number	US-201414483776-A
Country	US
Kind code	B2
Filing date	Sep 11, 2014
Priority date	Sep 13, 2012
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A semiconductor device is fastened to a heat dissipation member such that a force directed downward acts from a metal substrate onto the heat dissipation member, with a rim portion of a storage region as a fulcrum with respect to the heat dissipation member. As a result, a heat conductive material can be spread into a thinner layer between the metal substrate and the heat dissipation member, improving the heat dissipation between the metal substrate and the heat dissipation member.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a circuit board;
a semiconductor element disposed on a first side of the circuit board;
a metal substrate disposed on a second side of the circuit board;
a storage member having a storage region, a concave principal surface, an opening in which the circuit board is disposed with the metal substrate protruding from the concave principal surface, and fastener holes in the concave principal surface and configured to allow passage of fasteners; and
a heat dissipation member coupled to the storage member via fasteners disposed in the fastener holes such that a first end of the concave principal surface directly contacts the heat dissipation member, a second end of the concave principal surface directly contacts the metal substrate and is spaced apart from the heat dissipation member, and a distance between the metal substrate and the heat dissipation member is less than a distance between the second end of the concave principal surface and the heat dissipation member,
wherein the concave principal surface is configured only by a flat surface or a curved surface and is in direct contact with the metal substrate.

2. The semiconductor device according to claim 1 , wherein the concave principal surface is formed in such a manner that a portion of the storage region outside the fastener holes protrudes in a direction away from the circuit board.

3. The semiconductor device according to claim 2 , wherein the fastener holes face each other with the metal substrate therebetween.

4. The semiconductor device according to claim 1 , wherein the metal substrate has a convex surface that protrudes in a direction away from the circuit board.

5. The semiconductor device according to claim 4 , wherein the metal substrate has a mound shape.

6. The semiconductor device according to claim 4 , wherein the metal substrate has a semi-cylindrical shape.

7. The semiconductor device according to claim 6 , wherein the fastener holes have an oval or rectangular shape in a radial direction and are formed as a pair such that major axes thereof are in line with each other with the metal substrate therebetween.

8. The semiconductor device according to claim 1 , wherein the circuit board is sealed together with the semiconductor element by a resin.

9. The semiconductor device according to claim 1 , further comprising:
a heat conducting material disposed between the heat dissipation member and the metal substrate.

10. The semiconductor device according to claim 9 , wherein the metal substrate protrudes toward the heat dissipation member.

11. The semiconductor device according to claim 1 , wherein distal end points of the storage member protrude in a direction away from the circuit board, and the metal substrate protrudes beyond the distal end points.

12. The semiconductor device according to claim 1 , wherein distal end points of the storage member protrude in a direction away from the circuit board, and the distal end points protrudes beyond the metal substrate.

13. A method for installing a heat dissipation member to a semiconductor device having a semiconductor element,
the semiconductor device comprising:
a circuit board;
a semiconductor element disposed on a first side of the circuit board;
a metal substrate disposed on a second side of the circuit board; and
a storage member having a storage region, a concave principal surface, an opening in which the circuit board is disposed with the metal substrate protruding from the concave
principal surface, and fastener holes in the concave principal surface and configured to allow passage of fasteners,
the method comprising:
arranging a heat dissipation member and the storage member with a heat conductive material therebetween so that the heat dissipation member faces the metal substrate;
inserting the fasteners into the fastener holes; and
coupling the heat dissipation member and the storage member using the fasteners such that a first end of the concave principal surface directly contacts the heat dissipation member, a second end of the concave principal surface directly contacts the metal substrate and is spaced apart from the heat dissipation member, and a distance between the metal substrate and the heat dissipation member is less than a distance between the second end of the concave principal surface and the heat dissipation member,
wherein the concave principal surface is configured only by a flat surface or a curved surface and is in direct contact with the metal substrate.

14. A semiconductor device configured to be disposed on a heat dissipation member, comprising:
a semiconductor element;
a circuit board including a first side on which the semiconductor element is disposed;
a metal substrate disposed on a second side of the circuit board;
a storage member having,
a concave principal surface,
an opening disposed within the concave principal surface, the opening accommodating the circuit board with the metal substrate protruding from the concave principal surface, and
fastener holes disposed in the concave principal surface, the fastener holes being configured to allow passage of the fasteners for fastening the metal substrate to the heat dissipation member disposed facing the metal substrate,
wherein the side surface of the metal substrate is in direct contact with the inside of the concave principal surface, and a rim portion of the concave principal surface protrudes in the same direction as the metal substrate, and
wherein the concave principal surface is configured only by a flat surface or a curved surface and is in direct contact with the metal substrate.

15. The semiconductor device according to claim 14 , wherein the rim portion is disposed outside of the fastener holes.

16. The semiconductor device according to claim 15 , wherein the end of the rim portion protrudes.

17. The semiconductor device according to claim 14 , wherein the storage member further includes a principal surface facing the concave principal surface, and the concave principal surface is inclined with respect to the principal surface of the storage member.

18. The semiconductor device according to claim 17 , wherein the concave principal surface is configured only by the flat surface.

19. The semiconductor device according to claim 17 , wherein the concave principal surface is configured only by the curved surface.

20. A semiconductor device configured to be disposed on a heat dissipation member, comprising:
a semiconductor element;
a circuit board including a first side on which the semiconductor element is disposed;
a metal substrate disposed on a second side of the circuit board;
a storage member having,
a concave principal surface,
an opening disposed within the concave principal surface, the opening accommodating the circuit board with the metal substrate protruding from the concave principal surface, and
fastener holes disposed in the concave principal surface, the fastener holes being configured to allow passage of the fasteners for fastening the metal substrate to the heat dissipation member disposed facing the metal substrate,
wherein the side surface of the metal substrate is in direct contact with the inside of the concave principal surface, and a rim portion of the concave principal surface protrudes in the same direction as the metal substrate,
wherein the storage member further includes a principal surface facing the concave principal surface, and the concave principal surface is inclined with respect

Assignees

• Fuji Electric Co Ltd

Inventors

• Nishida Yuhei
• Nishizawa Tatsuo

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/136

  having other interconnections perpendicular to the conductive base · CPC title