Press pack power semiconductor device with locator strip
US-2025218971-A1 · Jul 3, 2025 · US
Cross-sectional shape
Cross-sectional shape · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/533 |
| Official title | {Cross-sectional shape} |
| Display label | Cross-sectional shape |
| Total patents | 51 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 5 |
| 2017 | 9 |
| 2018 | 5 |
| 2019 | 5 |
| 2020 | 7 |
| 2021 | 2 |
| 2022 | 2 |
| 2023 | 1 |
| 2024 | 6 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor apparatus and method for manufacturing the same, and power conversion apparatus
US-2025192098-A1 · Jun 12, 2025 · US
Semiconductor package, and a package on package type semiconductor package having the same
US-2025105217-A1 · Mar 27, 2025 · US
Semiconductor package, and a package on package type semiconductor package having the same
US-12166013-B2 · Dec 10, 2024 · US
Manufacturing method for bonded body, bonded body, manufacturing method for laminate, laminate, manufacturing method for device, and device, and composition for forming polyimide-containing precursor portion
US-2024339368-A1 · Oct 10, 2024 · US
Semiconductor module
US-2024304588-A1 · Sep 12, 2024 · US
Semiconductor device and method for fabricating the same
US-12027490-B2 · Jul 2, 2024 · US
Ai wiring material
US-2024110262-A1 · Apr 4, 2024 · US
Document structure formation
US-2024105669-A1 · Mar 28, 2024 · US
Al WIRING MATERIAL
US-2023302584-A1 · Sep 28, 2023 · US
Semiconductor package, and a package on package type semiconductor package having the same
US-2022359469-A1 · Nov 10, 2022 · US
Semiconductor device and method for fabricating the same
US-2022045031-A1 · Feb 10, 2022 · US
Coated wire
US-10960498-B2 · Mar 30, 2021 · US
Electrode connection structure, lead frame, and method for forming electrode connection structure
US-10903146-B2 · Jan 26, 2021 · US
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-10861774-B2 · Dec 8, 2020 · US
Semiconductor package with supported stacked die
US-10796975-B2 · Oct 6, 2020 · US
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-2020211932-A1 · Jul 2, 2020 · US
Devices related to shielded radio-frequency modules having reduced area
US-2020161255-A1 · May 21, 2020 · US
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-10629518-B2 · Apr 21, 2020 · US
Internally-shielded microelectronic packages and methods for the fabrication thereof
US-2020075463-A1 · Mar 5, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/533?
- CPC H10W72/533 is the Cooperative Patent Classification code for “Cross-sectional shape.”
- How many patents are filed under CPC H10W72/533 (Cross-sectional shape)?
- Our database includes 51 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/533 growing?
- Publication counts under this code: 6 in 2024 vs 3 in 2025 (latest complete years).