Conductive barrier direct hybrid bonding
US-2024243085-A1 · Jul 18, 2024 · US
Multiple die-attach connectors having different shapes
Multiple die-attach connectors having different shapes · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/337 |
| Official title | {Multiple die-attach connectors having different shapes} |
| Display label | Multiple die-attach connectors having different shapes |
| Total patents | 163 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 5 |
| 2017 | 12 |
| 2018 | 7 |
| 2019 | 15 |
| 2020 | 15 |
| 2021 | 11 |
| 2022 | 15 |
| 2023 | 16 |
| 2024 | 33 |
| 2025 | 20 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Multi layer thermal interface material
US-2020411411-A1 · Dec 31, 2020 · US
Package structure
US-2020402947-A1 · Dec 24, 2020 · US
Die stack assembly using an edge separation structure for connectivity through a die of the stack
US-10854581-B2 · Dec 1, 2020 · US
Semiconductor device and method of manufacturing same
US-2020294897-A1 · Sep 17, 2020 · US
Optical module and manufacturing method of optical module
US-2020286874-A1 · Sep 10, 2020 · US
Transceiver die interconnect interfaces
US-2020273824-A1 · Aug 27, 2020 · US
Die Stack Assembly Using An Edge Separation Structure For Connectivity Through A Die Of The Stack
US-2020266174-A1 · Aug 20, 2020 · US
Die stack assembly using an edge separation structure for connectivity through a die of the stack
US-10734362-B2 · Aug 4, 2020 · US
Semiconductor device
US-10685932-B2 · Jun 16, 2020 · US
Semiconductor package
US-10600729-B2 · Mar 24, 2020 · US
Light-emittng device
US-2020044115-A1 · Feb 6, 2020 · US
Method of manufacturing 3dic structure
US-2020013746-A1 · Jan 9, 2020 · US
Thermal management solutions for stacked integrated circuit devices
US-2019385933-A1 · Dec 19, 2019 · US
Thermal management solutions for stacked integrated circuit devices
US-2019385932-A1 · Dec 19, 2019 · US
3dic structure and method of manufacturing the same
US-2019355692-A1 · Nov 21, 2019 · US
Two material high K thermal encapsulant system
US-10475715-B2 · Nov 12, 2019 · US
3DIC structure and method of manufacturing the same
US-10475762-B1 · Nov 12, 2019 · US
Packaged integrated circuit having stacked die and method for therefor
US-10446476-B2 · Oct 15, 2019 · US
Conductive barrier direct hybrid bonding
US-2019237419-A1 · Aug 1, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/337?
- CPC H10W72/337 is the Cooperative Patent Classification code for “Multiple die-attach connectors having different shapes.”
- How many patents are filed under CPC H10W72/337 (Multiple die-attach connectors having different shapes)?
- Our database includes 163 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/337 growing?
- Publication counts under this code: 33 in 2024 vs 20 in 2025 (latest complete years).