Manufacturing method of semiconductor device and semiconductor device
US-2017309550-A1 · Oct 26, 2017 · US
Adapting interconnections, e.g. making engineering charges, repairing
Adapting interconnections, e.g. making engineering charges, repairing · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/092 |
| Official title | {Adapting interconnections, e.g. making engineering charges, repairing} |
| Display label | Adapting interconnections, e.g. making engineering charges, repairing |
| Total patents | 345 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 16 |
| 2016 | 22 |
| 2017 | 41 |
| 2018 | 42 |
| 2019 | 44 |
| 2020 | 35 |
| 2021 | 23 |
| 2022 | 32 |
| 2023 | 19 |
| 2024 | 26 |
| 2025 | 39 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor package having an emi shielding layer
US-2017287851-A1 · Oct 5, 2017 · US
Method for forming semiconductor structure
US-2017271206-A1 · Sep 21, 2017 · US
Semiconductor Device and Method of Forming Embedded Conductive Layer for Power/Ground Planes in FO-EWLB
US-2017263470-A1 · Sep 14, 2017 · US
Power amplifier modules with bonding pads and related systems, devices, and methods
US-2017257070-A1 · Sep 7, 2017 · US
Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods
US-9755592-B2 · Sep 5, 2017 · US
Method and device for permanently repairing defects of absent material of a photolithographic mask
US-2017248842-A1 · Aug 31, 2017 · US
Methods for making multi-die package with bridge layer
US-2017236724-A1 · Aug 17, 2017 · US
Interconnect structure and method of manufacturing the same
US-2017231083-A1 · Aug 10, 2017 · US
Semiconductor structure and method for forming the same
US-9704803-B2 · Jul 11, 2017 · US
Power amplifier modules with bifet and harmonic termination and related systems, devices, and methods
US-9692357-B2 · Jun 27, 2017 · US
Wafer level fan-out with electromagnetic shielding
US-2017133326-A1 · May 11, 2017 · US
Multi-die package with bridge layer and method for making the same
US-9640521-B2 · May 2, 2017 · US
Semiconductor device and manufacturing method thereof
US-2017117200-A1 · Apr 27, 2017 · US
Method for fabricating package structure
US-2017103953-A1 · Apr 13, 2017 · US
Donor cores to improve integrated circuit yield
US-9612988-B2 · Apr 4, 2017 · US
Semiconductor structure and method for forming the same
US-2017084536-A1 · Mar 23, 2017 · US
Semiconductor device and manufacturing method of the same
US-9589969-B1 · Mar 7, 2017 · US
Radio die package with backside conductive plate
US-2017062357-A1 · Mar 2, 2017 · US
Nano deposition and ablation for the repair and fabrication of integrated circuits
US-9583401-B2 · Feb 28, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/092?
- CPC H10W70/092 is the Cooperative Patent Classification code for “Adapting interconnections, e.g. making engineering charges, repairing.”
- How many patents are filed under CPC H10W70/092 (Adapting interconnections, e.g. making engineering charges, repairing)?
- Our database includes 345 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/092 growing?
- Publication counts under this code: 26 in 2024 vs 39 in 2025 (latest complete years).