Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment

Patent metadata

Field	Value
Publication number	US-9648781-B2
Application number	US-201213367432-A
Country	US
Kind code	B2
Filing date	Feb 7, 2012
Priority date	Feb 11, 2011
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

The present invention discloses an external thermal conduction interface structure of electrical equipment wherein a fluid jetting device is utilized to jet a thermal conductive fluid for exchanging heat with the external thermal conduction interface structure of electrical equipment via the thermal energy of the jetted thermal conductive fluid, the heat exchange means includes the external thermal conduction interface structure of electrical equipment having relative high temperature being cooled by a fluid have relative lower temperature, and external thermal conduction interface structure of electrical equipment having relative lower temperature being heated by a fluid having relative higher temperature.

First claim

The invention claimed is:

1. A temperature equalization apparatus, comprising:
at least one fluid jetting device ( 103 ) for jetting a thermally conductive fluid ( 104 ) by directing a jet of the thermally conductive fluid ( 104 ) upwardly toward an external thermal conduction interface structure ( 101 ) of an electrical equipment ( 100 ), said thermally conductive fluid exchanging heat with the thermal conduction interface structure to conduct heat away from the electrical equipment ( 100 );
a fluid collecting basin ( 105 ) for collecting the thermal conductive fluid ( 104 ) after it has exchanged heat with the thermal conduction interface structure ( 101 );
a fluid introducing pipe ( 1031 ) extending from within said fluid collecting basin ( 105 ) to the fluid jetting device ( 103 ) for returning the thermally conductive fluid ( 104 ) to the fluid jetting device ( 103 ), thereby circulating the thermal conductive fluid ( 104 ) between the jetting device ( 103 ), the thermal conduction interface structure ( 101 ), and the fluid collecting basin ( 105 ); and
a temperature equalizing device ( 102 ) installed in a natural thermal energy body ( 200 ) and connected to the fluid connecting basin ( 105 ) by a pipeline ( 108 ), said pipeline ( 108 ) supplying said thermal conducting fluid ( 104 ) from the fluid collecting basin ( 105 ) to the temperature equalizing device ( 102 ), wherein thermal energy acquired by the thermal conductive fluid ( 104 ) from the external thermal conduction interface structure ( 101 ) is dissipated in said natural thermal energy body ( 200 ), and
wherein the fluid jetting device ( 103 ) is at least one of an electrical, mechanical, and ultrasonic device for drawing, without a pump, said thermal conductive fluid from the fluid collecting basin ( 105 ) or the pipeline ( 108 ) and applying an upwardly directed jetting force to the thermally conductive fluid, and is installed between the fluid collecting basin ( 105 ) and the external thermal conduction interface structure ( 101 ) of the electric equipment ( 100 ).

2. A temperature equalization apparatus as claimed in claim 1 , wherein the fluid jetting device ( 103 ) injects the fluid in a small particle or fine mist state to a surface of the thermal conduction interface structure ( 101 ), such that the fluid in the small particle or fine mist state is accelerated as it is injected, thereby forcing a gaseous fluid that has already been evaporated away from the surface of the external thermal conduction interface structure ( 101 ).

3. A temperature equalization apparatus as claimed in claim 1 , wherein the fluid injecting device ( 103 ) is one of a dry-expansion type evaporator, a flooded type evaporator, a spray type evaporator, and a falling type evaporator.

4. A temperature equalization apparatus as claimed in claim 1 , wherein said pipeline ( 108 ) supplies said thermal conducting fluid ( 104 ) from the fluid collecting basin ( 105 ) to the temperature equalizing device ( 102 ) and from the temperature equalizing device ( 102 ) to the fluid introducing pipe ( 1031 ), the fluid introducing pipe ( 1031 ) supplying said thermal conductive fluid ( 104 ) directly from the pipeline ( 108 ) to the fluid jetting device ( 103 ).

5. A temperature equalization apparatus as claimed in claim 4 , wherein said pipeline ( 108 ) supplies said thermal conducting fluid ( 104 ) from the fluid collecting basin ( 105 ) to the temperature equalizing device ( 102 ) and from the temperature equalizing device ( 102 ) back to the fluid collecting basin ( 105 ).

6. A temperature equalization apparatus as claimed in claim 5 , further comprising a fluid pump ( 106 ) for pumping said thermal conducting fluid ( 104 ) through said pipeline ( 108 ) and thermal equalizing device ( 102 ).

7. A temperature equalization apparatus as claimed in claim 5 , further comprising a heat exchanging device ( 120 ) positioned in the fluid collecting basin ( 105 ) and immersed in said thermal conduction fluid ( 104 ), said pipeline ( 108 ) having an inlet and an outlet respectively connected to the heat exchanging device ( 120 ) for circulating said thermal conduction fluid ( 104 ) from the fluid collecting basin ( 105 ) through the heat ex/changing device ( 120 ) and the pipeline ( 108 ) to the thermal equalizing device ( 102 ) and back through the pipeline ( 108 ) and heat exchanging device ( 120 ) to the fluid collecting basin ( 105 ).

8. A temperature equalization apparatus as claimed in claim 1 , further comprising a relay heat exchanging device ( 121 ) installed between the fluid collecting basin ( 105 ) and the temperature equalizing device ( 102 ), said relay heat exchanging device ( 121 ) having a primary side fluid inlet connected to the fluid collecting basin ( 105 ) by said pipeline ( 108 ) and a primary side fluid outlet, wherein said primary side fluid outlet of the relay heat exchanging device ( 121 ) is connected to said jetting device ( 103 ) by said pipeline ( 108 ) and by a fluid introducing pipe ( 1031 ) that directly connects the pipeline ( 108 ) and the jetting device ( 103 ), and wherein a fluid pump ( 106 ) and said temperature equalizing device ( 102 ) are installed in said pipeline ( 108 ) between a secondary side fluid inlet and a secondary side fluid outlet of the relay heat exchanging device ( 121 ).

9. A temperature equalization apparatus as claimed in claim 1 , further comprising a relay heat exchanging device ( 121 ) installed between the fluid collecting basin ( 105 ) and the temperature equalizing device ( 102 ), said relay heat exchanging device ( 121 ) having a primary side fluid inlet and a primary side fluid outlet connected to the fluid collecting basin ( 105 ) by said fluid pipeline ( 108 ), wherein a fluid pump ( 106 ) and said temperature equalizing device ( 102 ) are installed in the fluid pipeline ( 108 ) between a secondary side fluid inlet and a secondary side fluid outlet of the relay heat exchanging device ( 121 ), and wherein the fluid collecting basin ( 105 ) is connected to the jetting device ( 103 ) by a fluid introducing pipe ( 1031 ).

10. A temperature equalization apparatus as claimed in claim 9 , further comprising a second fluid pump ( 1061 ) installed in said pipeline ( 108 ) between said relay heat exchanging device ( 121 ) and said fluid collecting basis ( 105 ).

11. A temperature equalization apparatus as claimed in claim 9 , wherein said relay heat exchanging device ( 121 ) is installed between the temperature equalizing device ( 102 ) and a plurality of said fluid collecting basins ( 105 ), fluid jetting devices ( 103 ), external conductive interface structures ( 101 ), and electronic equipment ( 100 ).

12. A temperature equalization apparatus as claimed in claim 9 , wherein said temperature equalizing device ( 102 ) is connected to a plurality of said relay heat exchanging devices ( 121 ), fluid collecting basins ( 105 ), fluid jetting devices ( 103 ), external conductive interface structures ( 101 ), and electronic equipment ( 100 ).

13. A temperature equalization apparatus as claimed in claim 1 , wherein said natural thermal energy body ( 200 ) is one of an earth surface, earth stratum, river, lake, artificial water channel, pipeline, and pond.

14. A temperature equalization apparatus as claimed in claim 1 , wherein the electrical equipment ( 100 ) includes at least one of the following: a light-emitting device including light emitting diodes (LEDs) for converting electric energy into optical energy, a photovoltaic or concentrating photovoltaic device for converting optical energy into electric energy, a photoelectric device, a transistor, a diode, a thyristor, a sil

Assignees

• Yang Tai-Her

Inventors

• Yang Tai-Her

Classifications

• H10W40/475

  using jet impingement (H10W40/776 takes precedence) · CPC title

• H05K7/20381

  Thermal management, e.g. evaporation control · CPC title

• H05K7/20345 Primary

  Sprayers; Atomizers · CPC title

• H01L2924/00

  Electricity · mapped topic

• H01L2924/0002

  Electricity · mapped topic