Direct air impingement cooling of package structures

Patent metadata

Field	Value
Publication number	US-9612060-B2
Application number	US-201113992422-A
Country	US
Kind code	B2
Filing date	Dec 30, 2011
Priority date	Dec 7, 2010
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

Various embodiments of microelectronic package cooling assemblies are described. Those embodiments include a cooling assembly comprising an array of vertically separated micro channels coupled to a heat spreader, wherein the heat spreader is finless, and wherein each inlet micro channel has two adjacent outlet micro channels. A distance between individual vertically separated micro channels comprises less than about 20 microns, and a heat pipe is embedded in the heat spreader.

First claim

What is claimed is:

1. A cooling assembly comprising:
a first array of vertically separated micro channels coupled to a first heat spreader, wherein the first heat spreader is finless, and wherein the first array of vertically separated micro channels includes a plurality of inlet micro channels and a plurality of outlet micro channels, and which each outlet micro channel has two adjacent inlet micro channels, such that there are twice as many inlet micro channels as outlet micro channels within the first array of vertically separated micro channels;
a first heat pipe embedded in the first heat spreader, wherein the first heat pipe has a liquid/fluid coolant disposed therein;
a second heat spreader disposed above the first heat spreader; and
a fluid source coupled to the first array of vertically separated micro channels, wherein the liquid/fluid coolant of the first heat pipe is separate from the fluid source of the first array of vertically separated micro channels.

2. The cooling assembly of claim 1 wherein the fluid comprises one of a liquid and a compressed gas.

3. The cooling assembly of claim 1 wherein the micro channels comprise a height of less than about 2 mm.

4. The cooling assembly of claim 1 further comprising a second heat pipe embedded in the second heat spreader, wherein a portion of the first heat pipe and a portion of the second heat pipe are bent.

5. The cooling assembly of claim 1 further comprising a third heat spreader disposed above the second heat spreader.

6. The cooling assembly of claim 1 wherein a distance between individual vertically separated micro channels comprises between about 20 to about 200 microns.

7. The cooling assembly of claim 1 further comprising a die coupled to the cooling assembly.

8. The cooling assembly of claim 7 further comprising a TIM coupled to the die, wherein the die is coupled with a package structure.

9. The cooling assembly of claim 1 further comprising a second heat pipe embedded in the second heat spreader, wherein the first heat pipe and the second heat pipe are in fluid communication with one another.

10. The cooling assembly of claim 1 further comprising a second heat pipe embedded in the second heat spreader and a third heat spreader disposed above the second heat spreader.

11. The cooling assembly of claim 10 further comprising a third heat pipe embedded in the third heat spreader.

12. The cooling assembly of claim 11 wherein the third heat pipe and the second heat pipe are in fluid communication with one another.

13. The cooling assembly of claim 12 wherein the third heat pipe and the second heat pipe are in fluid communication with the first heat pipe.

Assignees

• Sauciuc Ioan
• Intel Corp

Inventors

• Sauciuc Ioan

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W40/475

  using jet impingement (H10W40/776 takes precedence) · CPC title

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• F28F23/00

  Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions (heat-transfer, heat-exchange or heat-storage materials C09K5/00) · CPC title