Liquid-cooled, composite heat sink assemblies

Patent metadata

Field	Value
Publication number	US-2017045300-A1
Application number	US-201514824492-A
Country	US
Kind code	A1
Filing date	Aug 12, 2015
Priority date	Aug 12, 2015
Publication date	Feb 16, 2017
Grant date	—

Abstract

Liquid-cooled heat sink assemblies are provided which include: a heat transfer element including a heat transfer base with opposite first and second sides and a plurality of thermally conductive fins extending from the first side, and with the second side of the heat transfer base to couple to a component(s) to be cooled. The heat sink assembly further includes a coolant-carrying structure attached to the heat transfer element. The coolant-carrying structure includes a coolant-carrying base, and a coolant-carrying compartment through which liquid coolant flows. The coolant-carrying base includes a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins to extend therethrough. The plurality of thermally conductive fins extend into the coolant-carrying compartment through which the liquid coolant flows. In one or more embodiments, the heat transfer element is a metal structure and the coolant-carrying structure is a plastic structure.

First claim

1 . An apparatus comprising:
a liquid-cooled heat sink assembly including:
a heat transfer element comprising a heat transfer base having opposite first and second sides, and a plurality of thermally conductive fins extending from the first side of the heat transfer base, the second side of the heat transfer base to couple to at least one component to be cooled; and
a coolant-carrying structure attached to the heat transfer element, the coolant-carrying structure including a coolant-carrying base, and a coolant-carrying compartment through which liquid coolant flows, the coolant-carrying base comprising a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins of the heat transfer element to extend therethrough, wherein the plurality of thermally conductive fins extend through the coolant-carrying base into the coolant-carrying compartment of the coolant-carrying structure through which liquid coolant flows.

2 . The apparatus of claim 1 , wherein the liquid-cooled heat sink assembly is a composite liquid-cooled heat sink assembly, with the heat transfer element being a metal structure, and the coolant-carrying structure being a plastic structure.

3 . The apparatus of claim 2 , wherein the plurality of thermally conductive fins of the heat transfer element comprise an array of thermally conductive pin fins extending from the heat transfer base.

4 . The apparatus of claim 1 , wherein the liquid-cooled heat sink assembly further comprises a fluid-tight seal between the heat transfer element and the coolant-carrying structure, and the plurality of fin-receiving openings are sized and configured to provide an interference fit of the plurality of thermally conductive fins therein, the interference fit facilitating providing the fluid-tight seal between the heat transfer base and the coolant-carrying structure.

5 . The apparatus of claim 1 , wherein the liquid-cooled heat sink assembly comprises a fluid-tight seal between the heat transfer element and the coolant-carrying structure, and the liquid-cooled heat sink assembly further comprises an adhesive sealant between the first side of the heat transfer base of the heat transfer element and the coolant-carrying base of the coolant-carrying structure, the adhesive sealant facilitating providing the fluid-tight seal between the heat transfer element and the coolant-carrying structure.

6 . The apparatus of claim 1 , wherein the coolant-carrying structure further comprises a manifold structure associated with the coolant-carrying base, the manifold structure facilitating providing the liquid coolant flow through the coolant-carrying compartment of the coolant-carrying structure.

7 . The apparatus of claim 6 , wherein the manifold structure comprises:
a coolant inlet and a coolant outlet; and at least one inlet orifice in fluid communication with the coolant inlet and the coolant-carrying compartment, and at least one outlet orifice in fluid communication with the coolant outlet and the coolant-carrying compartment, wherein the liquid coolant flows through the coolant inlet, the at least one inlet orifice, the coolant-carrying compartment and the at least one outlet orifice, to the coolant outlet.

8 . The apparatus of claim 7 , wherein the at least one inlet orifice of the manifold structure comprises at least one inlet slot positioned over a central region of the coolant-carrying compartment and facilitating the liquid coolant flow into the coolant-carrying compartment in the central region thereof.

9 . The apparatus of claim 1 , wherein the liquid-cooled heat sink assembly comprises a plurality of heat transfer elements, the heat transfer element being one heat transfer element of the plurality of heat transfer elements, and wherein each heat transfer element of the plurality of heat transfer elements comprises a respective heat transfer base having opposite first and second sides, and a respective plurality of thermally conductive fins extending from the first side thereof, and wherein the plurality of heat transfer elements of the liquid-cooled heat sink assembly are attached to the coolant-carrying: structure and spaced apart with a gap therebetween, with the respective pluralities of thermally conductive fins extending through respective pluralities of fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment.

10 . The apparatus of claim 9 , wherein the respective pluralities of thermally conductive fins extending from the first side of at least one heat transfer base of at least one heat transfer element of the plurality of heat transfer elements comprise a respective array of thermally conductive pin fins extending from the heat transfer base.

11 . The apparatus of claim 9 , wherein the liquid-roofed heat sink assembly is a composite liquid-cooled heat sink assembly, with the plurality of heat transfer elements being a plurality of metal structures, and the coolant-carrying structure being a plastic structure.

12 . An apparatus comprising:
at least one electronic component to he cooled; and a liquid-cooled heat sink assembly coupled to the at least one electronic component to facilitate cooling thereof, the liquid-cooled heat sink assembly including:
a heat transfer element comprising a heat transfer base having opposite first and second sides, and a plurality of thermally conductive fins extending from the first side of the heat transfer base, the second side of the heat transfer base being coupled to at least one electronic component to be cooled; and
a coolant-carrying structure attached to the heat transfer element, the coolant-carrying structure including a coolant-carrying base, and a coolant-carrying compartment through which liquid coolant flows, the coolant-carrying base comprising a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins of the heat transfer element to extend therethrough, wherein the plurality of thermally conductive fins extend through the plurality of fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment of the coolant-carrying structure through which the liquid coolant flows.

13 . The apparatus of claim 12 , wherein the liquid-cooled heat sink assembly is a composite liquid-cooled heat sink assembly, with the heat transfer element being a metal structure, and the coolant-carrying structure being a plastic structure.

14 . The apparatus of claim 13 , wherein the plurality of thermally conductive fins of the heat transfer element comprise an array of thermally conductive pin fins extending from the heat transfer base.

15 . The apparatus of claim 12 , wherein the liquid-cooled heat sink assembly further comprises a fluid-tight seal between the heat transfer element and the coolant-carrying structure and the plurality of fin-receiving openings are sized and configured to provide an interference fit of the plurality of thermally conductive fins therein, the interference fit facilitating providing the fluid-tight seal between the heat transfer base and the coolant-carrying structure.

16 . The apparatus of claim 12 , wherein the liquid-cooled heat sink assembly comprises a fluid-tight seal between the heat transfer element and the coolant-carrying structure, and the liquid-cooled heat sink assembly further comprises an adhesive sealant between the first side of the heat transfer base of the heat transfer element and the coolant-carrying base of the coolant-carrying structure, the adhesive sealant facilitating providing the fluid-tight seal between the heat tr

Assignees

• IBM

Inventors

• Boday Dylan J
• Campbell Levi A
• David Milnes P
• Demetriou Dustin W
• Ellsworth Jr Michael J
• Schmidt Roger R
• Simons Robert E
• Singh Prabjit
• Wertz Jason T

Classifications

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title

• B23P15/26 Primary

  heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

• B23P2700/10

  Heat sinks · CPC title

• F28F3/12

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title

• F28F3/02

  Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title