Heat dissipation apparatus and electronic device

Patent metadata

Field	Value
Publication number	US-9823716-B2
Application number	US-201615085556-A
Country	US
Kind code	B2
Filing date	Mar 30, 2016
Priority date	Dec 28, 2015
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

Disclosed is a heat dissipation apparatus and an electronic device. The heat dissipation apparatus is suitable for a processor in an electronic device. The heat dissipation apparatus includes a housing including an inlet for introducing a cooling fluid into the housing and an outlet for allowing the cooling fluid to exit from the housing. The heat dissipation apparatus includes a heat dissipating member disposed in the housing. The heat dissipation apparatus includes a buffer member disposed between the inlet and the heat dissipating member. The buffer member includes through-holes for inhibiting a flow of the cooling liquid from the inlet of the housing to the dissipating member to transfer heat across the heat dissipating member to the cooling fluid. The electronic device may include a processor and the heat dissipation apparatus.

First claim

What is claimed is:

1. An apparatus comprising:
a housing comprising an inlet for introducing a cooling fluid into the housing, and an outlet for allowing the cooling fluid to exit from the housing;
a heat dissipating member disposed in the housing; and
a buffer member disposed between the inlet and the heat dissipating member in the housing, the buffer member comprising a plurality of through-holes for inhibiting a flow of the cooling fluid from the inlet of the housing to the heat dissipating member to transfer heat across the heat dissipating member to the cooling fluid;
wherein a sum of areas of the through-holes of the buffer member occupies 30% to 40% of an area of the buffer member, inclusively.

2. The apparatus of claim 1 , wherein the buffer member comprises thermally conductive material.

3. The apparatus of claim 2 , wherein the thermally conductive material is stainless steel, aluminum, or copper.

4. The apparatus of claim 3 , wherein the buffer member is produced by a stamping process.

5. The apparatus of claim 1 , wherein the buffer member connects to the housing by at least one of: welding and riveting.

6. The apparatus of claim 1 , wherein the heat dissipating member comprises a plurality of protrusions disposed on a surface.

7. The apparatus of claim 6 , wherein at least part of the surface of the heat dissipating member and the plurality of protrusions comprises a rough surface.

8. The apparatus of claim 7 , wherein the rough surface of the heat dissipating member and the protrusions are produced by a sandblasting process.

9. The apparatus of claim 1 , wherein the housing comprises a bottom baseplate, a top cover plate, and a sidewall fixedly connected to the bottom baseplate and the top cover plate, wherein the top cover plate comprises an inlet and an outlet.

10. The apparatus of claim 9 , wherein the plurality of through-holes of the buffer member comprise a plurality of first through-holes and at least one second through-hole, wherein the first through-holes communicate with the inlet of the top cover plate, and the second through-hole communicates with the outlet of the top cover plate.

11. The apparatus of claim 1 , wherein the housing comprises a hermetically sealed cavity.

12. The apparatus of claim 11 , wherein the heat dissipating member is disposed within the hermetically sealed cavity.

13. The apparatus of claim 12 , wherein the buffer member is disposed within the hermetically sealed cavity above the heat dissipating member.

14. An electronic device comprising:
a processor; and,
an apparatus comprising:
a housing comprising an inlet for introducing a cooling fluid into the housing, and an outlet for allowing the cooling fluid to exit from the housing:
a heat dissipating member disposed in the housing, the heat dissipating member being operative to transfer heat away from the processor; and
a buffer member disposed between the inlet and the heat dissipating member in the housing, the buffer member comprising a plurality of through-holes for inhibiting a flow of the cooling fluid from the inlet of the housing to the heat dissipating member to transfer heat across the heat dissipating member to the cooling fluid;
wherein a sum of areas of the through-holes of the buffer member occupies 30% to 40% of an area of the buffer member, inclusively.

15. A method comprising:
providing a housing comprising an inlet and an outlet;
providing a heat dissipating member disposed in the housing;
providing a buffer member disposed between the inlet and the heat dissipating member;
providing a plurality of through-holes disposed on the buffer member;
introducing a cooling fluid into the housing;
inhibiting a flow of the cooling fluid from the inlet to the heat dissipating member;
transferring heat across the heat dissipating member to the cooling fluid; and
allowing the cooling fluid to exit from the housing;
wherein a sum of areas of the through-holes of the buffer member occupies 30% to 40% of an area of the buffer member, inclusively.

16. The method of claim 15 , further comprising providing a bottom baseplate, a top cover plate, and a sidewall fixedly connected to the bottom baseplate and the top cover plate, wherein the top cover plate comprises an inlet and an outlet.

17. The method of claim 16 , wherein the plurality of through-holes of the buffer member comprise a plurality of first through-holes and at least one second through-hole, wherein the first through-holes communicate with the inlet of the top cover plate, and the second through-hole communicates with the outlet of the top cover plate.

18. The method of claim 15 , further comprising providing a plurality of protrusions disposed on a surface of the heat dissipating member.

Assignees

• Lenovo Beijing Ltd

Inventors

• Wang Cuicui

Classifications

• H10W40/475

  using jet impingement (H10W40/776 takes precedence) · CPC title

• F28F13/003

  by using permeable mass, perforated or porous materials (F28F13/18 takes precedence) · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• F28D15/00

  Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls {; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies (F28D17/00, F28D19/00, F28D20/00 take precedence)} · CPC title

• F28F21/085

  from copper or copper alloys · CPC title