Method and apparatus for chip cooling

Patent metadata

Field	Value
Publication number	US-9887146-B2
Application number	US-201514611684-A
Country	US
Kind code	B2
Filing date	Feb 2, 2015
Priority date	May 28, 2008
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.

First claim

What is claimed is:

1. An apparatus for cooling a heat generating device, the apparatus comprising:
a liquid coolant;
an inlet for receiving the liquid coolant;
a manifold coupled to the inlet, the manifold having a plurality of apertures formed therein for impinging the liquid coolant on the heat-generating device;
an outlet coupled to the manifold for removing a flow of the liquid coolant from the heat-generating device, wherein the outlet is directed towards at least one additional heat generating device; and
a duct enclosing the liquid coolant, the inlet, the manifold, and the outlet, wherein the duct includes an opening that introduces a flow of air into the liquid coolant as the liquid coolant exits from the outlet, wherein the flow of air is unforced and originates from an environment that is external to the apparatus.

2. The apparatus of claim 1 , wherein the manifold further comprises a plurality of grooves forming a corresponding plurality of channels between facing surfaces of the manifold and the heat generating device.

3. The apparatus of claim 2 , wherein the plurality of channels is arranged to duct the liquid coolant to a periphery of the heat generating device.

4. The apparatus of claim 1 , further comprising:
a valve adapted for coupling to a supply of the liquid coolant and for controlling a provision of the liquid coolant from the supply to the manifold; and
a voltage sensor for monitoring a temperature of the heat generating device, the voltage sensor being configured to control the valve such that an amount of the liquid coolant supplied to the manifold is sufficient to maintain a steady temperature on the heat generating device.

5. The apparatus of claim 4 , further comprising:
a heat exchanger coupled between the valve and the supply of the liquid coolant, for lowering a temperature of the liquid coolant prior to the liquid coolant being provided to the manifold, wherein the heat exchanger comprises a pipe through which the liquid coolant passes, and the pipe is immersed in a cooling agent.

6. The apparatus of claim 1 , further comprising:
an interposer plate configured for thermal coupling to the heat-generating device.

7. The apparatus of claim 6 , wherein the interposer plate comprises a plurality of fins.

8. The apparatus of claim 6 , further comprising a thermal interface material for enhancing thermal coupling of the interposer plate to the heat-generating device.

9. The apparatus of claim 8 , wherein the thermal interface material comprises at least one of: thermal grease, thermal adhesive, thermal cement, or a solder thermal interface.

10. The apparatus of claim 1 , wherein the liquid coolant is substantially non-toxic.

11. The apparatus of claim 1 , wherein the liquid coolant is expandable into a gas for a removal from the apparatus and for recompression into a liquid after the removal.

12. The apparatus of claim 1 , wherein the apparatus is coupled in series with at least one additional apparatus that is similarly configured.

13. The apparatus of claim 12 , wherein a second outlet of the apparatus is coupled to an inlet of the at least one additional apparatus.

14. The apparatus of claim 1 , wherein the opening employs suction to introduce the flow of air.

15. The apparatus of claim 1 , wherein the flow of air is generated by non-motorized means.

16. The apparatus of claim 1 , further comprising:
a skirt positioned around a perimeter of the manifold and coupled to the outlet.

17. A system comprising:
a printed circuit board including a plurality of heat-generating components;
a computer chip coupled to the printed circuit board; and
a cooling system positioned to cool at least the computer chip, the cooling system comprising:
a liquid coolant;
an inlet for receiving the liquid coolant;
a manifold coupled to the inlet, the manifold having a plurality of apertures formed therein for impinging the liquid coolant on the computer chip;
an outlet coupled to the manifold for removing a flow of the liquid coolant from the computer chip, wherein the outlet is directed towards at least one of the plurality of heat-generating components other than the computer chip; and
a duct enclosing the liquid coolant, the inlet, the manifold, and the outlet, wherein the duct includes an opening that introduces a flow of air into the liquid coolant as the liquid coolant exits from the outlet, wherein the flow of air is unforced and originates from an environment that is external to the cooling system.

18. The system of claim 17 , wherein the opening employs suction to introduce the flow of air.

19. The system of claim 17 , wherein the flow of air is generated by non-motorized means.

Assignees

• IBM

Inventors

• Flotta Matteo
• Martin Yves C
• Romankiw Lubomyr T
• Van Kessel Theodore G

Classifications

• H10W40/475 Primary

  using jet impingement (H10W40/776 takes precedence) · CPC title

• H05K7/20772

  within server blades for removing heat from heat source · CPC title

• H05K7/20381

  Thermal management, e.g. evaporation control · CPC title

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H01L2924/0002

  Electricity · mapped topic