Pellicle fabrication methods and structures thereof
US-10162258-B2 · Dec 25, 2018 · US
for lift-off processes
for lift-off processes · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P76/403 |
| Official title | {for lift-off processes} |
| Display label | for lift-off processes |
| Total patents | 152 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 11 |
| 2016 | 13 |
| 2017 | 17 |
| 2018 | 26 |
| 2019 | 19 |
| 2020 | 17 |
| 2021 | 8 |
| 2022 | 9 |
| 2023 | 11 |
| 2024 | 11 |
| 2025 | 7 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor structure having layer with re-entrant profile and method of forming the same
US-10157773-B1 · Dec 18, 2018 · US
Methods for processing a semiconductor workpiece
US-10157765-B2 · Dec 18, 2018 · US
Boron film removing method, and pattern forming method and apparatus using boron film
US-2018350598-A1 · Dec 6, 2018 · US
Selective SiARC removal
US-10115591-B2 · Oct 30, 2018 · US
Method for making thin film transistor
US-2018301543-A1 · Oct 18, 2018 · US
Patterned sidewall smoothing using a pre-smoothed inverted tone pattern
US-10068991-B1 · Sep 4, 2018 · US
Patterned sidewall smoothing using a pre-smoothed inverted tone pattern
US-2018240892-A1 · Aug 23, 2018 · US
Patterned sidewall smoothing using a pre-smoothed inverted tone pattern
US-2018240894-A1 · Aug 23, 2018 · US
Photoresist stripping apparatus, and methods of stripping photoresist and forming thin film pattern using the same
US-2018203360-A1 · Jul 19, 2018 · US
Sacrificial layer for platinum patterning
US-2018204767-A1 · Jul 19, 2018 · US
Method for manufacturing semiconductor device
US-10026622-B2 · Jul 17, 2018 · US
Selective SiARC Removal
US-2018197730-A1 · Jul 12, 2018 · US
Etching method and substrate processing system
US-2018166295-A1 · Jun 14, 2018 · US
Array substrate and manufacturing method for the same
US-2018151444-A1 · May 31, 2018 · US
Surface modification process for laser application
US-9966260-B1 · May 8, 2018 · US
Method of manufacturing semiconductor device
US-2018122717-A1 · May 3, 2018 · US
Array substrate and manufacturing method for the same
US-9905470-B2 · Feb 27, 2018 · US
Semiconductor chip device
US-9875978-B2 · Jan 23, 2018 · US
Method for manufacturing semiconductor device
US-2017271170-A1 · Sep 21, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P76/403?
- CPC H10P76/403 is the Cooperative Patent Classification code for “for lift-off processes.”
- How many patents are filed under CPC H10P76/403 (for lift-off processes)?
- Our database includes 152 publications tagged with this CPC code.
- Is patent activity under CPC H10P76/403 growing?
- Publication counts under this code: 11 in 2024 vs 7 in 2025 (latest complete years).