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Semiconductor die singulation method and apparatus
US2015332969A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015332969-A1 |
| Application number | US-201514808729-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 24, 2015 |
| Priority date | Nov 7, 2012 |
| Publication date | Nov 19, 2015 |
| Grant date | — |
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Abstract
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In one embodiment, die are singulated from a wafer having a back layer by placing the wafer onto a first carrier substrate with the back layer adjacent the carrier substrate, forming singulation lines through the wafer to expose the back layer within the singulation lines, and using a mechanical device to apply localized pressure to the wafer to separate the back layer in the singulation lines. The localized pressure can be applied through the first carrier substrate proximate to the back layer, or can be applied through a second carrier substrate attached to a front side of the wafer opposite to the back layer.
First claim
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What is claimed is: 1 - 29 . (canceled) 30 . An apparatus for separating die from a wafer comprising: a structure for holding the wafer on a carrier substrate, wherein the wafer has a plurality of singulation lines that terminate proximate to a layer of material on the wafer; and a structure for applying a localized pressure to the wafer through the carrier substrate. 31 . The apparatus of claim 30 , wherein the structure for appl…
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Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US2015332969A1 cover?
- In one embodiment, die are singulated from a wafer having a back layer by placing the wafer onto a first carrier substrate with the back layer adjacent the carrier substrate, forming singulation lines through the wafer to expose the back layer within the singulation lines, and using a mechanical device to apply localized pressure to the wafer to separate the back layer in the singulation lines.…
- Who is the assignee on this patent?
- Semiconductor Components Ind
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Nov 19 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).