Method of manufacturing semiconductor device
US-2019333758-A1 · Oct 31, 2019 · US
characterised by the part to be cleaned
characterised by the part to be cleaned · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P70/50 |
| Official title | {characterised by the part to be cleaned} |
| Display label | characterised by the part to be cleaned |
| Total patents | 197 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 16 |
| 2017 | 19 |
| 2018 | 19 |
| 2019 | 22 |
| 2020 | 18 |
| 2021 | 17 |
| 2022 | 23 |
| 2023 | 23 |
| 2024 | 13 |
| 2025 | 22 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Solder removal from semiconductor devices
US-10307850-B2 · Jun 4, 2019 · US
Systems and methods for plasma-less de-halogenation
US-2019051540-A1 · Feb 14, 2019 · US
Substrate processing method and substrate processing apparatus
US-10121648-B2 · Nov 6, 2018 · US
Method of cleaning and drying semiconductor substrate
US-2018315594-A1 · Nov 1, 2018 · US
Unit for supplying fluid, apparatus and method for treating substrate with the unit
US-10109506-B2 · Oct 23, 2018 · US
Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
US-10096460-B2 · Oct 9, 2018 · US
Semiconductor device manufacturing method, substrate processing apparatus and vacuum processing apparatus
US-2018261458-A1 · Sep 13, 2018 · US
Substrate processing method and substrate processing apparatus
US-2018247837-A1 · Aug 30, 2018 · US
Substrate processing method
US-2018207685-A1 · Jul 26, 2018 · US
Method for cleaning substrate
US-10020184-B2 · Jul 10, 2018 · US
Substrate treating apparatus and substrate treating method
US-2018182628-A1 · Jun 28, 2018 · US
Substrate processing method
US-9956594-B2 · May 1, 2018 · US
Substrate processing method and substrate processing system
US-9953840-B2 · Apr 24, 2018 · US
Substrate processing apparatus
US-9933702-B2 · Apr 3, 2018 · US
Substrate processing device which performs processing on substrate
US-2018090332-A1 · Mar 29, 2018 · US
Method for cleaning substrate and cleaning device
US-2018047565-A1 · Feb 15, 2018 · US
Method of Growing High Quality, Thick SiC Epitaxial Films by Eliminating Silicon Gas Phase Nucleation and Suppressing Parasitic Deposition
US-2018044816-A1 · Feb 15, 2018 · US
Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
US-2018040469-A1 · Feb 8, 2018 · US
Method of growing high quality, thick SiC epitaxial films by eliminating silicon gas phase nucleation and suppressing parasitic deposition
US-9885124-B2 · Feb 6, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P70/50?
- CPC H10P70/50 is the Cooperative Patent Classification code for “characterised by the part to be cleaned.”
- How many patents are filed under CPC H10P70/50 (characterised by the part to be cleaned)?
- Our database includes 197 publications tagged with this CPC code.
- Is patent activity under CPC H10P70/50 growing?
- Publication counts under this code: 13 in 2024 vs 22 in 2025 (latest complete years).