Substrate processing method and substrate processing system

Patent metadata

Field	Value
Publication number	US-9953840-B2
Application number	US-201615371707-A
Country	US
Kind code	B2
Filing date	Dec 7, 2016
Priority date	Dec 25, 2015
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

A substrate processing method according to the present disclosure includes: a liquid processing process of supplying a processing liquid to a substrate having a surface on which a pattern having a plurality of convex portions is formed; a drying process of removing the processing liquid existing on the surface of the substrate dry the substrate, and a separating process of separating a sticking portion between adjacent ones of the convex portions after the drying process.

First claim

What is claimed is:

1. A substrate processing method comprising:
a liquid processing process of supplying a processing liquid to a substrate having a surface on which a pattern having a plurality of convex portions is formed;
a drying process of removing the processing liquid existing on the surface of the substrate to dry the substrate; and
a separating process of separating a sticking portion between adjacent ones of the convex portions after the drying process.

2. The substrate processing method of claim 1 , wherein the separating process separates the sticking portion by etching the sticking portion with an etching gas supplied to the substrate.

3. The substrate processing method of claim 2 , further comprising a thermal processing process of heating the substrate after the separating process.

4. The substrate processing method of claim 2 , wherein the etching gas is a mixture of ammonia gas and hydrogen fluoride gas.

5. The substrate processing method of claim 4 , wherein the surfaces of the convex portions where the sticking portion is formed are made of silicon or a silicon oxide.

6. The substrate processing method of claim 1 , wherein the liquid processing process includes a chemical liquid processing process of supplying a chemical liquid to the substrate, and a rinsing process of washing the chemical liquid from the surface of the substrate by supplying a rinse liquid to the substrate, and the drying process is performed after the rinsing process.

7. The substrate processing method of claim 1 , wherein the liquid processing process includes: a chemical liquid processing process of supplying a chemical liquid to the substrate; a rinsing process of washing the chemical liquid from the surface of the substrate by supplying a rinse liquid to the substrate; and a replacing process of replacing the rinse liquid on the surface of the substrate with a solvent having a higher volatility than that of the rinse liquid by supplying the solvent to the substrate, and
the drying process is performed after the replacing process.

8. The substrate processing method of claim 2 , wherein the separating process is performed in a decompressed atmosphere.

9. The substrate processing method of claim 2 , wherein the etching gas is supplied by moving along the surface of the substrate.

10. The substrate processing method of claim 2 , wherein the separating process is performed in the decompressed atmosphere and at a higher temperature than a room temperature.

11. The substrate processing method of claim 1 , wherein the liquid processing process includes: a chemical liquid processing process of supplying a chemical liquid to the substrate; a rinsing process of washing the chemical liquid from the surface of the substrate by supplying a rinse liquid to the substrate; and a hydrophobization processing process of forming a hydrophobized protecting film on the substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Marumoto Hiroshi
• Kawano Hisashi
• Kiyose Hiromi
• Nakamori Mitsunori
• Mitsuoka Kazuyuki

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0422

  for wet etching · CPC title

• H10P72/0421

  for drying etching · CPC title

• H10P72/0411

  for wet cleaning or washing · CPC title