Substrate cleaning method, substrate cleaning system, and storage medium
US-2021265180-A1 · Aug 26, 2021 · US
by combined dry cleaning and wet cleaning (H10P70/52 takes precedence)
by combined dry cleaning and wet cleaning (H10P70/52 takes precedence) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P70/18 |
| Official title | {by combined dry cleaning and wet cleaning (H10P70/52 takes precedence)} |
| Display label | by combined dry cleaning and wet cleaning (H10P70/52 takes precedence) |
| Total patents | 105 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 9 |
| 2017 | 9 |
| 2018 | 9 |
| 2019 | 13 |
| 2020 | 11 |
| 2021 | 9 |
| 2022 | 10 |
| 2023 | 8 |
| 2024 | 9 |
| 2025 | 7 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Apparatus and method for treating a substrate
US-2020406311-A1 · Dec 31, 2020 · US
Substrate processing method and substrate processing apparatus
US-2020411309-A1 · Dec 31, 2020 · US
Drying apparatus, substrate processing system, and drying method
US-2020365425-A1 · Nov 19, 2020 · US
System and method for enhanced removal of metal hardmask using ultra violet treatment
US-10828680-B2 · Nov 10, 2020 · US
Substrate processing apparatus, substrate processing method and memory medium
US-10707098-B2 · Jul 7, 2020 · US
Method for fabricating a monocrystalline structure
US-2020194259-A1 · Jun 18, 2020 · US
Substrate processing apparatus having cooling member
US-10679845-B2 · Jun 9, 2020 · US
Source supplier for a supercritical fluid, substrate processing apparatus having the same
US-10668403-B2 · Jun 2, 2020 · US
Single use rinse in a linear Marangoni drier
US-10672628-B2 · Jun 2, 2020 · US
Substrate processing apparatus and substrate processing method
US-10576493-B2 · Mar 3, 2020 · US
Apparatus and method for wafer cleaning
US-2020055099-A1 · Feb 20, 2020 · US
Method for cleaning, passivation and functionalization of Si—Ge semiconductor surfaces
US-10483097-B2 · Nov 19, 2019 · US
Composition for semiconductor process and semiconductor process
US-2019276740-A1 · Sep 12, 2019 · US
Method and device for reducing contamination for reliable bond pads
US-10410854-B2 · Sep 10, 2019 · US
Substrate processing method and substrate processing apparatus
US-2019237322-A1 · Aug 1, 2019 · US
Substrate processing method and substrate processing apparatus
US-10366877-B2 · Jul 30, 2019 · US
Method and device for reducing contamination for reliable bond pads
US-2019206676-A1 · Jul 4, 2019 · US
Determination method and substrate processing equipment
US-2019172732-A1 · Jun 6, 2019 · US
Method of producing liquid crystal panel
US-2019108996-A1 · Apr 11, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P70/18?
- CPC H10P70/18 is the Cooperative Patent Classification code for “by combined dry cleaning and wet cleaning (H10P70/52 takes precedence).”
- How many patents are filed under CPC H10P70/18 (by combined dry cleaning and wet cleaning (H10P70/52 takes precedence))?
- Our database includes 105 publications tagged with this CPC code.
- Is patent activity under CPC H10P70/18 growing?
- Publication counts under this code: 9 in 2024 vs 7 in 2025 (latest complete years).