Multi-layer release stack for light induced transfer of components
US-2025204119-A1 · Jun 19, 2025 · US
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Debonding of wafers, substrates or parts of devices
Debonding of wafers, substrates or parts of devices · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P56/00 |
| Official title | Debonding of wafers, substrates or parts of devices |
| Display label | Debonding of wafers, substrates or parts of devices |
| Total patents | 15 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 1 |
| 2017 | 1 |
| 2018 | 3 |
| 2019 | 1 |
| 2020 | 2 |
| 2021 | 1 |
| 2024 | 2 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method and substrate system for the separation of carrier substrates
US-2025153481-A1 · May 15, 2025 · US
Polycrystalline silicon carbide substrate and method of manufacturing the same
US-2024332011-A1 · Oct 3, 2024 · US
Substrate processing apparatus and substrate processing method
US-2024082957-A1 · Mar 14, 2024 · US
Wafer debonding system and method
US-10889097-B2 · Jan 12, 2021 · US
Wafer debonding system and method
US-2020108592-A1 · Apr 9, 2020 · US
Wafer debonding system and method
US-10569520-B2 · Feb 25, 2020 · US
Wafer debonding system and method
US-2019118522-A1 · Apr 25, 2019 · US
Wafer debonding system and method
US-10155369-B2 · Dec 18, 2018 · US
Wafer debonding system and method
US-2018147825-A1 · May 31, 2018 · US
Device and method for loosening a first substrate
US-9922862-B2 · Mar 20, 2018 · US
Thin epitaxial silicon carbide wafer fabrication
US-9761493-B2 · Sep 12, 2017 · US
Device and method for loosening a first substrate
US-2016329235-A1 · Nov 10, 2016 · US
Wafer support system and method for separating support substrate from solid-phase bonded wafer and method for manufacturing semiconductor device
US-9147599-B2 · Sep 29, 2015 · US
Thin epitaxial silicon carbide wafer fabrication
US-2015214040-A1 · Jul 30, 2015 · US