Method for manufacturing semiconductor structure and semiconductor structure thereof
US-2024381776-A1 · Nov 14, 2024 · US
Forming enclosures or casings
Forming enclosures or casings · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10N30/02 |
| Official title | Forming enclosures or casings |
| Display label | Forming enclosures or casings |
| Total patents | 391 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 24 |
| 2016 | 23 |
| 2017 | 30 |
| 2018 | 45 |
| 2019 | 35 |
| 2020 | 39 |
| 2021 | 39 |
| 2022 | 41 |
| 2023 | 48 |
| 2024 | 36 |
| 2025 | 20 |
| 2026 | 11 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Barrier layer on a piezoelectric-device pad
US-2024314500-A1 · Sep 19, 2024 · US
Normally-closed flow rate control valve
US-11867317-B1 · Jan 9, 2024 · US
Hermetic sealing lid member, method for manufacturing hermetic sealing lid member, and electronic component housing package
US-2017354049-A1 · Dec 7, 2017 · US
Micromechanical component and method for packaging a substrate having a micro-electromechanical microphone structure which includes at least one piezoelectric layer
US-2017332176-A1 · Nov 16, 2017 · US
Piezoelectric oscillation component and method for manufacturing the same
US-2017294568-A1 · Oct 12, 2017 · US
Tactile vibration applying device
US-2017285751-A1 · Oct 5, 2017 · US
Sensor device
US-2017256699-A1 · Sep 7, 2017 · US
Method of manufacturing an electronic component
US-9735340-B2 · Aug 15, 2017 · US
Liquid ejecting head, liquid ejecting apparatus and piezoelectric element
US-9731505-B2 · Aug 15, 2017 · US
Piezoelectric actuator
US-2017222123-A1 · Aug 3, 2017 · US
Pressure sensor device with high sensitivity and high accuracy
US-9651441-B2 · May 16, 2017 · US
Electronic component package, electronic component package sealing member and method for producing the electronic component package sealing member
US-9620702-B2 · Apr 11, 2017 · US
Piezoelectric/electrostrictive actuator
US-2016380177-A1 · Dec 29, 2016 · US
Piezoelectric element
US-9530954-B2 · Dec 27, 2016 · US
Liquid ejecting head, liquid ejecting apparatus and piezoelectric element
US-2016368268-A1 · Dec 22, 2016 · US
Piezoelectric device, liquid ejecting head, liquid ejecting apparatus and manufacturing method of piezoelectric device
US-9522536-B2 · Dec 20, 2016 · US
Piezoelectric linear actuator, piezoelectrically driven valve, and flow rate control device
US-2016363231-A1 · Dec 15, 2016 · US
Electrostrictive element manufacturing method
US-2016351790-A1 · Dec 1, 2016 · US
Vibration type actuator and ultrasonic motor
US-2016336875-A1 · Nov 17, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10N30/02?
- CPC H10N30/02 is the Cooperative Patent Classification code for “Forming enclosures or casings.”
- How many patents are filed under CPC H10N30/02 (Forming enclosures or casings)?
- Our database includes 391 publications tagged with this CPC code.
- Is patent activity under CPC H10N30/02 growing?
- Publication counts under this code: 36 in 2024 vs 20 in 2025 (latest complete years).