Piezoelectric device, liquid ejecting head, liquid ejecting apparatus and manufacturing method of piezoelectric device

Patent metadata

Field	Value
Publication number	US-9522536-B2
Application number	US-201514858382-A
Country	US
Kind code	B2
Filing date	Sep 18, 2015
Priority date	Sep 19, 2014
Publication date	Dec 20, 2016
Grant date	Dec 20, 2016

Abstract

A piezoelectric device comprising a substrate having two surface sides; a vibration plate on one of the two surface side, a piezoelectric element including a first electrode provided on the vibration plate, a piezoelectric body layer provided on the first electrode, the piezoelectric body layer having a groove section on a side surface, the groove section including a first surface facing to the vibration plate, and a second electrode provided on the piezoelectric body layer, and a stress application film having tensile stress and provided on an inner surface of the groove section.

First claim

What is claimed is:

1. A piezoelectric device comprising:
a substrate having first and second surface opposite to each other;
a vibration plate on the first surface of the substrate;
a piezoelectric element including:
a first electrode provided on the vibration plate;
a piezoelectric body layer provided on the first electrode;
a groove provided on a side surface of the piezoelectric body layer, the groove including a first groove surface facing to the vibration plate; and
a second electrode provided on the piezoelectric body layer; and

a stress application film having tensile stress and provided on an inner surface of the groove,
wherein the stress application film is provided to reach up to an upper surface of the second electrode on a side that is opposite to the piezoelectric body layer, and an opening section is provided in a region of the stress application film that corresponds to a central section of an upper surface of the piezoelectric element.

2. The piezoelectric device according to claim 1 ,
wherein the first groove surface of the groove is inclined with respect to a lamination direction of the first electrode, the piezoelectric body layer, and the second electrode, and the first groove surface of the groove is an inclined surface that is inclined with respect to a top surface of the vibration plate.

3. The piezoelectric device according to claim 1 ,
wherein the groove includes a second groove surface that is provided toward a side of the second electrode, the second groove surface is inclined with respect to a lamination direction of the first electrode, the piezoelectric body layer, and the second electrode, and the second groove surface is an inclined surface that is inclined with respect to a top surface of the vibration plate.

4. The piezoelectric device according to claim 1 ,
wherein a first thickness of the stress application film from the vibration plate is greater than or equal to 100% and less than or equal to 200% with respect to a second thickness of the piezoelectric element from the vibration plate.

5. The piezoelectric device according to claim 1 ,
wherein internal stress in the second electrode is compressive stress.

6. The piezoelectric device according to claim 1 ,
wherein the stress application film is a photosensitive resin.

7. A liquid ejecting head comprising:
the piezoelectric device according to claim 1 :
a pressure generation chamber that is formed in the substrate: and
nozzle openings that communicate with the pressure generation chamber and eject a liquid.

8. A liquid ejecting apparatus comprising:
liquid ejecting head according to claim 7 .

9. A manufacturing method of a piezoelectric device comprising:
preparing a substrate having first and second surfaces opposite to each other;
providing a vibration plate on the first surface of the substrate;
providing a first electrode on the vibration plate;
providing a piezoelectric body layer on the first electrode, a groove being provided on a side surface of the piezoelectric body layer, and the groove including a first groove surface facing to the vibration plate;
providing a second electrode on the piezoelectric body layer; and
providing a stress application film having tensile stress inside, on an inner surface of the groove,
wherein the stress application film is provided to reach up to an upper surface of the second electrode on a side that is opposite to the piezoelectric body layer, and an opening section is provided in a region of the stress application film that corresponds to a central section of an upper surface of the piezoelectric body layer.

10. The manufacturing method of a piezoelectric device according to claim 9 ,
wherein a plurality of the grooves are formed simultaneously by forming a laminate of a plurality of piezoelectric body layers and patterning the laminate using wet etching.

11. The manufacturing method of a piezoelectric device according claim 9 ,
wherein the stress application film is formed by a liquid phase method.

12. A piezoelectric device comprising:
a substrate having first and second surfaces opposite to each other;
a vibration plate on the first surface of the substrate;
a piezoelectric element including:
a first electrode provided on the vibration plate;
a piezoelectric body layer provided on the first electrode;
a groove provided on a side surface of the piezoelectric body layer, the groove including a first groove surface facing to the vibration plate; and
a second electrode provided on the piezoelectric body layer; and

a stress application film having tensile stress and provided on an inner surface of the groove,
wherein a first thickness of the stress application film from the vibration plate is greater than or equal to 100% and less than or equal to 200% with respect to a second thickness of the piezoelectric element from the vibration plate.

13. A piezoelectric device comprising:
a substrate having first and second surfaces opposite to each other;
a vibration plate on the first surface of the substrate;
a piezoelectric element including:
a first electrode provided on the vibration plate;
a piezoelectric body layer provided on the first electrode;
a groove provided on a side surface of the piezoelectric body layer, the groove including a first groove surface facing to the vibration plate; and
a second electrode provided on the piezoelectric body layer; and

a stress application film having tensile stress and provided on an inner surface of the groove,
wherein a plurality of the piezoelectric elements are provided on the vibration plate including a first piezoelectric body layer and a second piezoelectric body layer, and
the stress application film is continuously provided at an entirety between the groove of the first piezoelectric body layer and the groove of the second piezoelectric body layer on the vibration plate.

Assignees

• Seiko Epson Corp

Inventors

• Furuya Noboru
• Nakayama Masao
• Hahiro Hideki

Classifications

• B41J2/1632

  machining · CPC title

• B41J2002/14241

  having a cover around the piezoelectric thin film element · CPC title

• B41J2202/11

  characterised by specific geometrical characteristics · CPC title

• B41J2/1634

  laser machining · CPC title

• B41J2002/14419

  Manifold · CPC title