Liquid Ejecting Head Manufacturing Method, Liquid Ejecting Head, And Liquid Ejecting Apparatus
US-2024308221-A1 · Sep 19, 2024 · US
US2016368268A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016368268-A1 |
| Application number | US-201615254197-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 1, 2016 |
| Priority date | Nov 28, 2011 |
| Publication date | Dec 22, 2016 |
| Grant date | — |
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A piezoelectric element includes a plurality of individual electrodes, a piezoelectric layer formed on each of individual electrodes, and a common electrode which is formed on the piezoelectric layer and is an electrode common to the individual electrodes. Further, a protection film covering a region, which is not covered by the common electrode on the individual electrode, is provided.
Opening claim text (preview).
What is claimed is: 1 . A piezoelectric device comprising: a substrate having a first major surface and a second major surface; a chamber formed in the substrate, the chamber including a sidewall having a first end at the first major surface and a second end at the second major surface; a first electrode formed on the first major surface of substrate, and overlapping the first end; a piezoelectric layer formed on the first electrode; a second electrode formed on the piezoelectric layer; and a protection layer formed on the piezoelectric layer and the second electrode, wherein the protection layer is laterally offset from the first end in a plan view. 2 . The piezoelectric device according to claim 1 , wherein the protection layer includes a first portion overlapping the second electrode and a second portion overlapping the piezoelectric layer, and the first portion is laterally offset from the first end in the plan view. 3 . The piezoelectric device according to claim 1 , further comprising a vibration plate between the first major surface of the substrate and the first electrode. 4 . The piezoelectric device according to claim 1 , further comprising an active region and a non-active region, the protection layer overlapping the active region and the non-active region, and a portion of the protection layer overlapping the active region is laterally offset from the first end in the plan view. 5 . A liquid ejecting head comprising the piezoelectric device according to claim 1 . 6 . A liquid ejecting head, comprising: a substrate having a recess formed therein, the recess having a sidewall including a first end and a second end; a vibration plate formed on the substrate, overlapping the first end; a first electrode formed on the vibration plate; a piezoelectric layer formed on the first electrode; a second electrode formed on the piezoelectric layer; and a protection layer formed on the piezoelectric layer and the second electrode, wherein the protection layer is laterally offset from the first end in a plan view. 7 . The liquid ejecting head of claim 6 , wherein the recess defines a pressure chamber. 8 . The liquid ejecting head of claim 6 , wherein the protection layer includes a first portion overlapping the second electrode and a second portion overlapping the piezoelectric layer, and the first portion is laterally offset from the first end in the plan view. 9 . The liquid ejecting head of claim 6 , further comprising an active region and a non-active region, the protection layer overlapping the active region and the non-active region, and a portion of the protection layer overlapping the active region is laterally offset from the sidewall in the plan view. 10 . A method of manufacturing a piezoelectric device, comprising: providing a substrate including a first major surface and a second major surface; forming a first electrode on the first major surface of the substrate; forming a piezoelectric layer on the first electrode; forming a second electrode on the piezoelectric layer; forming a protection layer on the piezoelectric layer and the second electrode; and forming a chamber having a sidewall in the substrate such that a first end of the sidewall is at the first major surface and a second end of the sidewall is formed at the second major surface, wherein a first portion of the protection layer overlaps the piezoelectric layer, and a second portion of the protection layer overlaps the second electrode; and the second portion is positioned outboard from the first end. 11 . The method of claim 10 , further comprising defining an active region and an inactive region of the piezoelectric layer, and positioning the protection layer on the piezoelectric layer and the second electrode such that the protection layer overlaps a boundary between the active region and the inactive region. 12 . The method of claim 11 , wherein the boundary is laterally offset from the first end in the plan view. 13 . The method of claim 10 , further comprising forming a vibration plate between the substrate and the first electrode. 14 . A liquid ejecting head, comprising: a substrate having a pressure chamber; a vibration plate formed on the substrate and overlapping the pressure chamber, a region of the vibration plate being exposed to the pressure chamber; a first electrode formed on the vibration plate; a piezoelectric layer formed on the first electrode; and a protection layer formed on the piezoelectric layer and the second electrode, wherein the protection layer is laterally offset from the region in a plan view. 15 . A liquid ejecting head, comprising: a substrate having a first major surface and a second major surface; a chamber formed in the substrate, and having a first opening at the first major surface and a second opening at the second major surface; a first electrode formed on the first major surface of substrate, and overlapping the first opening; a piezoelectric layer formed on the first electrode; a second electrode formed on the piezoelectric layer; and a protection layer formed on the piezoelectric layer and the second electrode, wherein the protection layer is laterally offset from the first opening in a plan view. 16 . The liquid ejecting head according to claim 15 , further comprising a vibration plate between the first major surface of the substrate and the first electrode. 17 . A liquid ejecting apparatus comprising the liquid ejecting head according to claim 5 . 18 . A liquid ejecting apparatus comprising the liquid ejecting head according to claim 6 . 19 . A liquid ejecting apparatus comprising the liquid ejecting head according to claim 14 . 20 . A liquid ejecting apparatus comprising the liquid ejecting head according to claim 15 .
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