Glass clad microelectronic substrate
US-2016343650-A1 · Nov 24, 2016 · US
Forming printed elements for providing electric connections to or between printed circuits
Forming printed elements for providing electric connections to or between printed circuits · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/40 |
| Official title | Forming printed elements for providing electric connections to or between printed circuits |
| Display label | Forming printed elements for providing electric connections to or between printed circuits |
| Total patents | 427 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 50 |
| 2016 | 49 |
| 2017 | 44 |
| 2018 | 46 |
| 2019 | 46 |
| 2020 | 36 |
| 2021 | 40 |
| 2022 | 35 |
| 2023 | 18 |
| 2024 | 30 |
| 2025 | 28 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Printed wiring board and a method of manufacturing a printed wiring board
US-9480170-B2 · Oct 25, 2016 · US
Wiring board
US-9425137-B2 · Aug 23, 2016 · US
Wiring board and method for manufacturing wiring board
US-9332638-B2 · May 3, 2016 · US
Electronic module having an electrically insulating structure with material having a low modulus of elasticity
US-2016113127-A1 · Apr 21, 2016 · US
Method of manufacturing printed wiring board
US-9313903-B2 · Apr 12, 2016 · US
Power distribution box
US-2016073520-A1 · Mar 10, 2016 · US
Packaged Semiconductor Devices And Methods of Packaging Thereof
US-2016066426-A1 · Mar 3, 2016 · US
Module with Integrated Power Electronic Circuitry and Logic Circuitry
US-2016050768-A1 · Feb 18, 2016 · US
Via structure having open stub and printed circuit board having the same
US-9264010-B2 · Feb 16, 2016 · US
Package apparatus and manufacturing method thereof
US-2015382469-A1 · Dec 31, 2015 · US
Capacitive blind-mate module interconnection
US-9219461-B2 · Dec 22, 2015 · US
Circuit board and method of manufacturing the same
US-2015366059-A1 · Dec 17, 2015 · US
Bridge interconnection with layered interconnect structures
US-2015364423-A1 · Dec 17, 2015 · US
Wiring substrate and method for producing the same
US-2015366058-A1 · Dec 17, 2015 · US
Circuit board, electronic component and method of manufacturing circuit board
US-2015342047-A1 · Nov 26, 2015 · US
Compensation for length differences in vias associated with differential signaling
US-2015325901-A1 · Nov 12, 2015 · US
Helmet configured for electronics
US-2015305425-A1 · Oct 29, 2015 · US
Method of manufacturing printed circuit board
US-9173300-B2 · Oct 27, 2015 · US
Method of manufacturing a wiring board having via structures
US-2015305157-A1 · Oct 22, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/40?
- CPC H05K3/40 is the Cooperative Patent Classification code for “Forming printed elements for providing electric connections to or between printed circuits.”
- How many patents are filed under CPC H05K3/40 (Forming printed elements for providing electric connections to or between printed circuits)?
- Our database includes 427 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/40 growing?
- Publication counts under this code: 30 in 2024 vs 28 in 2025 (latest complete years).