Method of manufacturing printed wiring board

Patent metadata

Field	Value
Publication number	US-9313903-B2
Application number	US-200913142113-A
Country	US
Kind code	B2
Filing date	Dec 24, 2009
Priority date	Dec 25, 2008
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

A method of manufacturing a printed wiring board ( 10 ) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole ( 3 a ); forming a first adhesive member ( 4 a ) on a lower surface of the core to cover the primary through hole ( 3 a ); charging an insulating member into the primary through hole ( 3 a ); forming a second adhesive member ( 4 b ) on an upper surface of the core; forming a third adhesive member ( 6 a ) below the first adhesive member ( 4 a ); forming a fourth adhesive member ( 6 b ) on the second adhesive member ( 4 b ); and forming interconnections on the core.

First claim

The invention claimed is:

1. A method of manufacturing a printed wiring board, comprising the steps of:
forming first and second laminated bodies each having first and second adhesive members;
laminating said first laminated body and said second laminated body so that said first laminated body and said second laminated body are symmetric to each other about a central line located between said first and second laminated bodies, by forming a positioning hole in said first laminated body when said first and second adhesive members are in an uncured state, and inserting a positioning member into said positioning hole to perform positioning; and
forming interconnections on said first and second laminated bodies,
wherein said step of forming said first and second laminated bodies includes the steps of
forming a core including carbon fiber reinforced plastic having a primary through hole,
temporarily pressure-bonding the first adhesive member on a lower surface of said core to cover said primary through hole,
charging an insulating member into said primary through hole by screen printing, and
temporarily pressure-bonding the second adhesive member on said insulating member on an upper surface of said core, and
wherein the insulating member is charged after formation of the first adhesive member.

2. The method of manufacturing a printed wiring board according to claim 1 , wherein
said step of forming said first and second laminated bodies further includes the steps of forming a third adhesive member below said first adhesive member, and forming a fourth adhesive member on said second adhesive member, and
in said step of laminating, said first laminated body and said second laminated body are laminated by forming a positioning hole in said first laminated body when said first, second, third, and fourth adhesive members are in an uncured state, and inserting a positioning member into said positioning hole to perform positioning.

3. The method of manufacturing a printed wiring board according to claim 1 , wherein, in said step of laminating, a multi-layer board having a pattern and an insulating base material covering said pattern is disposed between said first laminated body and said second laminated body.

Assignees

• Samejima Sohei
• Ozaki Tsuyoshi
• Osuga Hiroyuki
• Kumada Teruhiko
• Mitsubishi Electric Corp

Inventors

• Samejima Sohei
• Ozaki Tsuyoshi
• Osuga Hiroyuki
• Kumada Teruhiko

Classifications

• H05K3/40

  Forming printed elements for providing electric connections to or between printed circuits · CPC title

• H05K3/02

  in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding · CPC title

• H05K3/0011

  Working of insulating substrates or insulating layers · CPC title

• H05K3/4641

  having integrally laminated metal sheets or special power cores · CPC title

• H05K2201/0195

  Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure · CPC title