Wiring board

Patent metadata

Field	Value
Publication number	US-9425137-B2
Application number	US-201414552771-A
Country	US
Kind code	B2
Filing date	Nov 25, 2014
Priority date	Jan 22, 2010
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

A wiring board includes multiple insulating layers including first, second, third, fourth and fifth insulation layers laminated in the order of the first, second, third, fourth and fifth insulation layers. The first insulation layer has a first conductor including plating, the second insulation layer has a second conductor including plating, the third insulation layer has a third conductor including conductive paste, the fourth insulation layer has a fourth conductor including plating, the fifth insulation layer has a fifth conductor including plating, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along the same axis and are electrically continuous with each other.

First claim

What is claimed is:

1. A wiring board, comprising:
a plurality of insulating layers comprising a first insulation layer, a second insulation layer, a third insulation layer, a fourth insulation layer and a fifth insulation layer laminated in an order of the first insulation layer, the second insulation layer, the third insulation layer, the fourth insulation layer and the fifth insulation layer, wherein the first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor comprising a plating formed in the first hole in the first insulation layer, the second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor comprising a plating formed in the second hole in the second insulation layer, the third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor comprising a conductive paste filled in the third hole of the third insulation layer, the fourth insulation layer has a fourth hole which penetrates through the fourth insulation layer and includes a fourth conductor comprising a plating formed in the fourth hole in the fourth insulation layer, the fifth insulation layer has a fifth hole which penetrates through the fifth insulation layer and includes a fifth conductor comprising a plating formed in the fifth hole in the fifth insulation layer, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along a same axis and are electrically continuous with each other;
a first land connected to the second conductor and the third conductor and formed in the third insulation layer; and
a second land connected to the third conductor and the fourth conductor and formed in the third insulation layer,
wherein the first land has a recess formed in a central portion of the first land, the second land has a recess formed in a central portion of the second land, and the conductive paste is filled in the recess of the first land and the recess of the second land.

2. The wiring board according to claim 1 , wherein at least one of the second insulation layer, the third insulation layer and the fourth insulation layer has a thickness which is set greater than a thickness of the first insulation layer and fifth insulation layer.

3. The wiring board according to claim 2 , wherein the second insulation layer, the third insulation layer and the fourth insulation layer have thicknesses which are set greater than the thickness of the first insulation layer and fifth insulation layer.

4. The wiring board according to claim 2 , further comprising:
a first wiring layer formed on a first surface of the first insulation layer;
a second wiring layer formed on a first surface of the second insulation layer and between the first and second insulation layers;
a third wiring layer formed on a second surface of the second insulation layer and between the second and third insulation layers;
a fourth wiring layer formed on a first surface of the fourth insulation layer and between the third and fourth insulation layers;
a fifth wiring layer formed on a second surface of the fourth insulation layer and between the fourth and fifth insulation layers; and
a sixth wiring layer formed on a second surface of the fifth insulation layer,
wherein at least one of the second, third, fourth and fifth wiring layers has a thickness which is set greater than a thickness of the first and sixth wiring layers.

5. The wiring board according to claim 4 , wherein the second, third, fourth and fifth wiring layers have thicknesses which are set greater than the thickness of the first and sixth wiring layers.

6. The wiring board according to claim 1 , further comprising:
a land connected to the second conductor and interposed between the first insulation layer and the second insulation layer,
wherein the first land has a width which is set greater than a width of the land interposed between the first insulation layer and the second insulation layer.

7. The wiring board according to claim 1 , further comprising:
a land connected to the fourth conductor and interposed between the fourth insulation layer and the fifth insulation layer,
wherein the second land has a width which is set greater than a width of the land interposed between the fourth insulation layer and the fifth insulation layer.

8. The wiring board according to claim 1 , further comprising:
a land connected to the second conductor and interposed between the first insulation layer and the second insulation layer; and
a land connected to the fourth conductor and interposed between the fourth insulation layer and the fifth insulation layer,
wherein the first land has a width which is set greater than a width of the land interposed between the first insulation layer and the second insulation layer, and the second land has a width which is set greater than a width of the land interposed between the fourth insulation layer and the fifth insulation layer.

9. The wiring board according to claim 1 , wherein the second hole has an opening facing an opening of the third hole, and the opening of the third hole has a width which is set greater than a width of the opening of the second hole.

10. The wiring board according to claim 1 , wherein the third hole has an opening facing an opening of the fourth hole, and the opening of the third hole has a width which is set greater than a width of the opening of the fourth hole.

11. The wiring board according to claim 1 , wherein the second hole has an opening facing an opening of the third hole, the opening of the third hole has a width which is set greater than a width of the opening of the second hole, the third hole has an opening facing an opening of the fourth hole, and the opening of the third hole has a width which is set greater than a width of the opening of the fourth hole.

12. The wiring board according to claim 1 , wherein the second conductor has a recess formed in a central portion of an end surface facing the first insulation layer.

13. The wiring board according to claim 1 , wherein the fourth conductor has a recess formed in a central portion of an end surface facing the fifth insulation layer.

14. The wiring board according to claim 1 , wherein the second conductor has a recess formed in a central portion of an end surface facing the first insulation layer, and the fourth conductor has a recess formed in a central portion of an end surface facing the fifth insulation layer.

15. The wiring board according to claim 1 , further comprising a built-in electronic component positioned in the wiring board.

16. The wiring board according to claim 1 , further comprising an electronic component mounted on a surface of the wiring board.

Assignees

• Ibiden Co Ltd

Inventors

• Naganuma Nobuyuki
• Takahashi Michimasa
• Aoyama Masakazu

Classifications

• H10W70/635

  Through-vias · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W70/685 Primary

  comprising multiple insulating layers · CPC title

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title