Wiring board and method for manufacturing wiring board

Patent metadata

Field	Value
Publication number	US-9332638-B2
Application number	US-201214118636-A
Country	US
Kind code	B2
Filing date	May 23, 2012
Priority date	May 26, 2011
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.

First claim

The invention claimed is:

1. A wiring board comprising:
a base including a front surface, a rear surface, and a side surface;
a first metal plate joined with the front surface;
a second metal plate joined with the rear surface; and
a conductive line configured to electrically connect the first metal plate and the second metal plate, wherein the conductive line is arranged in an inner space defined by an inner wall surface of a base through hole formed in the base or an outer space located at an outer side of the side surface of the base, and the conductive line includes the first metal plate, the second metal plate, and a conductive material electrically connecting the first metal plate and the second metal plate,
wherein at least one of the first metal plate and the second metal plate includes a joined portion, which is joined with the base, and a bent portion, which is bent and extended from the joined portion to cover the inner wall surface or the side surface, and
the conductive material fills an inner side of the bent portion,
wherein the second metal plate includes a through hole in a portion facing toward the inner space or the outer space, and wherein the first metal plate includes through hole formed in the bent portion of the first metal plate at a location corresponding to the base hole.

2. The wiring board according to claim 1 , wherein
the first metal plate includes a first joined portion, which serves as the joined portion, and a first bent portion, which serves as the bent portion, and the first bent portion is bent toward the rear surface;
the second metal plate includes a second joined portion, which serves as the joined portion, and a second bent portion, which serves as the bent portion, and the second bent portion is bent toward the front surface to cover the inner wall surface or the side surface together with the first bent portion; and
the conductive material is filled between the first bent portion and the second bent portion.

3. A wiring board comprising;
a base including a front surface, a rear surface, and a side surface;
a first metal plate joined with the front surface;
a second metal plate joined with the rear surface; and
a conductive line configured to electrically connect the first metal plate and the second metal plate, wherein the conductive line is arranged in an inner space defined by an inner wall surface of a base through hole formed in the base or an outer space located at an outer side of the side surface of the base, and the conductive line includes the first metal plate, the second metal plate, and a conductive material electrically connecting the first metal plate and the second metal plate,
wherein at least one of the first metal plate and the second metal plate includes a joined portion, which is joined with the base, and a bent portion, which is bent and extended from the joined portion to cover the inner wall surface or the side surface, and
the conductive material fills an inner side of the bent portion, wherein
the first metal plate includes a first joined portion, which serves as the joined portion, and a first bent portion, which serves as the bent portion, and the first bent portion is bent toward the rear surface;
the second metal plate includes a second joined portion, which serves as the joined portion, and a second bent portion, which serves as the bent portion, and the second bent portion is bent toward the front surface to cover the inner wall surface or the side surface together with the first bent portion; and
the conductive material is filled between the first bent portion and the second bent portion,
wherein
the conductive line is arranged in the inner space;
the first bent portion is bent toward the inner space from an open end of the base through hole that opens in the front surface, and the first bent portion includes a through hole in a portion corresponding to a central portion of the base through hole; and
the second bent portion is bent toward the inner space from an open end of the base through hole that opens in the rear surface, and the second bent portion is inserted into the through hole of the first bent portion.

4. A wiring board comprising:
a base including a front surface, a rear surface, and a side surface;
a first metal plate joined with the front surface;
a second metal plate joined with the rear surface; and
a conductive line configured to electrically connect the first metal plate and the second metal plate, wherein the conductive line is arranged in an inner space defined by an inner wall surface of a base through hole formed in the base or an outer space located at an outer side of the side surface of the base, and the conductive line includes the first metal plate, the second metal plate, and a conductive material electrically connecting the first metal plate and the second metal plate,
wherein at least one of the first metal plate and the second metal plate includes a joined portion, which is joined with the base, and a bent portion, which is bent and extended from the joined portion to cover the inner wall surface or the side surface, and
the conductive material fills an inner side of the bent portion,
wherein the second metal plate includes a through hole in a portion facing toward the inner space or the outer space,
wherein the through hole formed in the second metal plate is one of a plurality of through holes arranged on a circumference extending about a center axis of the base through hole, which has a circular cross-section.

5. The wiring board according to claim 4 , wherein the through holes formed in the second metal plate are arranged at equal angular intervals.

Assignees

• Ozaki Kiminori
• Koike Yasuhiro
• Asano Hiroaki
• Sato Harumitsu
• Watanabe Hiroki
• Kachi Tadayoshi
• Suzuki Takahiro
• Shimadu Hitoshi
• Furuta Tetsuya
• Miyake Masao
• Hayakawa Takahiro
• Asai Tomoaki
• Yamauchi Ryou
• Toyota Jidoshokki Kk

Inventors

• Ozaki Kiminori
• Koike Yasuhiro
• Asano Hiroaki
• Sato Harumitsu
• Watanabe Hiroki
• Kachi Tadayoshi
• Suzuki Takahiro
• Shimadu Hitoshi
• Furuta Tetsuya
• Miyake Masao
• Hayakawa Takahiro
• Asai Tomoaki
• Yamauchi Ryou

Classifications

• H05K2201/0969

  Apertured conductors · CPC title

• H05K3/40

  Forming printed elements for providing electric connections to or between printed circuits · CPC title

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title

• H05K3/4084 Primary

  by deforming at least one of the conductive layers · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title