Printed wiring board and a method of manufacturing a printed wiring board

Patent metadata

Field	Value
Publication number	US-9480170-B2
Application number	US-201113274897-A
Country	US
Kind code	B2
Filing date	Oct 17, 2011
Priority date	Jan 27, 2006
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm.

First claim

The invention claimed is:

1. A multilayer printed wiring board, comprising:
a substrate having a first side and a second side opposing the first side;
a first laminated structure formed on the first side of the substrate and including alternately laminated interlayer resin insulating layers and conductor layers;
a solder-resist layer formed on the first laminated structure and having a plurality of apertures exposing a plurality of portions of an outermost conductor layer of the first laminated structure, respectively, such that the plurality of apertures includes at least one first aperture having a first size and at least one second aperture having a second size which is larger than the first size; and
a plurality of solder bumps formed in the plurality of apertures respectively and having substantially equal volumes and substantially equal heights such that a difference in height of no greater than 10 μm is formed between a solder bump in a first aperture and a solder bump in a second aperture.

2. The multilayer printed wiring board according to claim 1 , wherein the at least one first aperture has a first diameter and the at least one second aperture has a second diameter such that the second diameter is larger than the first diameter.

3. The multilayer printed wiring board according to claim 2 , wherein the at least one second aperture having the second diameter is formed in a center area of the first laminated structure, and the at least one first aperture having the first diameter is formed on a peripheral area of the first laminated structure.

4. The multilayer printed wiring board according to claim 1 , wherein all of the solder bumps are approximately of the same height.

5. The multilayer printed wiring board according to claim 2 , wherein the solder bumps formed in the apertures having the first diameter have a flattened surface to be substantially equal in height to the solder bumps formed in the apertures having the second diameter.

6. The multilayer printed wiring board according to claim 2 , wherein the solder bumps formed in the apertures having the second diameter are semi-spherical in shape.

7. The multilayer printed wiring board according to claim 2 , wherein the solder bumps formed in the apertures having the first diameter have a flattened top surface and the solder bumps formed in the apertures having the second diameter have an unflattened curved top surface.

8. The multilayer printed wiring board according to claim 2 , wherein the solder bumps formed in the apertures having the first diameter have a flattened top surface and the solder bumps formed in the apertures having the second diameter have a flattened top surface.

9. The multilayer printed wiring board according to claim 2 , wherein the plurality of apertures comprises a plurality of first apertures each having a diameter of 80 μm and a plurality of second apertures each having a diameter of 105 μm.

10. The multilayer printed wiring board according to claim 9 , wherein the solder bumps formed in the first apertures and the solder bumps formed in the second apertures all have a height of approximately 30 μm.

11. The multilayer printed wiring board according to claim 10 , wherein each of the solder bumps formed in the first apertures has a flattened top surface and each of the solder bumps formed in the second apertures has an unflattened curved top surface.

12. The multilayer printed wiring board according to claim 1 , further comprising:
a second laminated structure formed on the second side of the substrate and including alternately laminated interlayer resin insulating layers and conductor layers.

13. The multilayer printed wiring board according to claim 12 , further comprising:
a second solder-resist layer formed on the second laminated structure and having a plurality of apertures exposing a plurality of portions of an outermost conductor layer of the second laminated structure, respectively.

14. The multilayer printed wiring board according to claim 13 , further comprising:
a plurality of second solder bumps formed in the plurality of apertures in the second solder-resist layer respectively and having substantially equal volumes and substantially equal heights.

15. The multilayer printed wiring board according to claim 1 , wherein the plurality of apertures comprises a plurality of first apertures each having the first diameter and a plurality of second apertures each having the second diameter.

16. The multilayer printed wiring board according to claim 15 , wherein the plurality of second apertures is formed in a center area of the first laminated structure, and the plurality of first apertures is formed on a peripheral area of the first laminated structure.

17. The multilayer printed wiring board according to claim 16 , wherein all of the solder bumps are approximately of the same height.

18. The multilayer printed wiring board according to claim 16 , wherein the solder bumps formed in the first apertures have a flattened surface to be substantially equal in height to the solder bumps formed in the second apertures.

19. The multilayer printed wiring board according to claim 16 , wherein each of the solder bumps formed in the second apertures has a semi-spherical shape.

20. The multilayer printed wiring board according to claim 16 , wherein each of the solder bumps formed in the first apertures has a flattened top surface, and each of the solder bumps formed in the second apertures has an unflattened curved top surface.

Assignees

• Tanno Katsuhiko
• Kawamura Youichirou
• Ibiden Co Ltd

Inventors

• Tanno Katsuhiko
• Kawamura Youichirou

Classifications

• H05K3/3436

  having an array of bottom contacts, e.g. pad grid array or ball grid array components · CPC title

• Y10T29/49121

  Beam lead frame or beam lead device · CPC title

• Y10T29/49142

  including metal fusion · CPC title

• H05K2203/0278

  Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive · CPC title

• H05K2201/094

  Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads · CPC title