Via structure having open stub and printed circuit board having the same

Patent metadata

Field	Value
Publication number	US-9264010-B2
Application number	US-201314027835-A
Country	US
Kind code	B2
Filing date	Sep 16, 2013
Priority date	Sep 18, 2012
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided.

First claim

What is claimed is:

1. A via structure having an open stub, comprising:
a signal transmission via passing through an insulating layer;
upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and
at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with ground patterns formed on and under the insulating layer,
wherein the signal transmission via passes through the insulating layer including a core insulating layer, an upper insulating layer, and a lower insulating layer,
the at least one open stub connected to the outer periphery of the upper via pad formed on the upper insulating layer has a shunt capacitance with an upper ground pattern formed on the upper insulating layer and an inner layer uppermost ground pattern formed on the core insulating layer and under the upper insulating layer, wherein a portion of the inner layer uppermost ground pattern is disposed directly under an end of the open stub connected to the outer periphery of the upper via pad, and
the at least one open stub connected to the outer periphery of the lower via pad formed on the lower insulating layer has a shunt capacitance with a lower ground pattern formed on the lower insulating layer and an inner layer lower lowermost ground pattern formed under the core insulating layer and on the lower insulating layer.

2. The via structure having an open stub according to claim 1 , wherein the via structure implements a low-pass filter by having a shunt capacitance due to the at least one open stub.

3. The via structure having an open stub according to claim 2 , wherein an operation frequency of the low-pass filter is adjusted by adjusting a line width and a length of the open stub.

4. The via structure having an open stub according to claim 1 , wherein a portion of the inner layer uppermost ground pattern is disposed directly under an end of the open stub connected to the outer periphery of the upper via pad, and
a portion of the inner layer lowermost ground pattern is disposed directly on an end of the open stub connected to the outer periphery of the lower via pad.

5. The via structure having an open stub according to claim 1 , wherein the signal transmission via comprises a core via portion passing through the core insulating layer, an upper via portion passing through the upper insulating layer, and a lower via portion passing through the lower insulating layer, and
the upper via pad connects the first transmission line formed on the upper insulating layer and the upper via portion, the lower via pad connects the second transmission line formed on the lower insulating layer and the lower via portion, and inner layer upper and inner layer lower via pads connects the upper and lower via portions and the core via portion while being formed on and under the core insulating layer.

6. The via structure having an open stub according to claim 1 , wherein the open stub has a rectangular or fan shape.

7. A printed circuit board with a via having an open stub, comprising:
an insulating layer;
a signal transmission via passing through the insulating layer, and having upper and lower via pads;
first and second transmission lines respectively formed on and under the insulating layer;
ground patterns respectively formed on and under the insulating layer to be spaced apart from the first and second transmission lines; and
at least one open stub connected to an outer periphery of each via pad for connecting each of the first and second transmission lines and the signal transmission via to have a shunt capacitance with each ground pattern on and under the insulating layer,
wherein the insulating layer comprises a core insulating layer, an upper insulating layer disposed on the core insulating layer, and a lower insulating layer disposed under the core insulating layer,
the first transmission line is formed on the upper insulating layer and the second transmission line is formed on the lower insulating layer,
an upper ground pattern is formed on the upper insulating layer to be spaced apart from the first transmission line, a lower ground pattern is formed on the lower insulating layer to be spaced apart from the second transmission line, an inner layer uppermost ground pattern is formed on the core insulating layer and under the upper insulating layer, and an inner layer lowermost ground pattern is formed under the core insulating layer and on the lower insulating layer, wherein a portion of the inner layer uppermost ground pattern is disposed directly under an end of the open stub connected to the outer periphery of the upper via pad, the at least one open stub connected to the outer periphery of an upper via pad formed on the upper insulating layer has a shunt capacitance with the upper ground pattern and the inner layer uppermost ground pattern, and
the at least one open stub connected to the outer periphery of a lower via pad formed on the lower insulating layer has a shunt capacitance with the lower ground pattern and the inner layer lowermost ground pattern.

8. The printed circuit board with a via having an open stub according to claim 7 , wherein the printed circuit board implements a low-pass filter by having a shunt capacitance due to the at least one open stub.

9. The printed circuit board with a via having an open stub according to claim 8 , wherein an operation of the low-pass filter is adjusted by adjusting a line width and a length of the open stub.

10. The printed circuit board with a via having an open stub according to claim 7 , wherein a portion of the inner layer uppermost ground pattern is disposed directly under an end of the open stub connected to the outer periphery of the upper via pad, and
a portion of the inner layer lowermost ground pattern is disposed directly on an end of the open stub connected to the outer periphery of the lower via pad.

11. The printed circuit board with a via having an open stub according to claim 7 , wherein the signal transmission via comprises a core via portion passing through the core insulating layer, an upper via portion passing through the upper insulating layer, and a lower via portion passing through the lower insulating layer, and
the upper via pad connects the first transmission line formed on the upper insulating layer and the upper via portion, the lower via pad connects the second transmission line formed on the lower insulating layer and the lower via portion, and inner layer upper and inner layer lower via pads connect the upper and lower via portions and the core via portion while being formed on and under the core insulating layer.

12. The printed circuit board with a via having an open stub according to claim 7 , wherein the open stub has a rectangular or fan shape.

Assignees

• Samsung Electro Mech

Inventors

• Lee Dong Hwan
• Park Seung Wook
• Romero Christian
• Kweon Young Do
• Kim Jin Gu

Classifications

• H05K2201/09381

  Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component · CPC title

• H03H7/17 Primary

  Structural details of sub-circuits of frequency selective networks · CPC title

• H05K1/0251 Primary

  related to vias or transitions between vias and transmission lines · CPC title

• H05K1/116

  Lands, clearance holes or other lay-out details concerning the surrounding of a via · CPC title

• H05K3/46 Primary

  Manufacturing multilayer circuits · CPC title