Resin film, coverlay for printed wiring board, substrate for printed wiring board, and printed wiring board
US-2017327630-A1 · Nov 16, 2017 · US
Cleaning or polishing of the conductive pattern
Cleaning or polishing of the conductive pattern · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/26 |
| Official title | Cleaning or polishing of the conductive pattern |
| Display label | Cleaning or polishing of the conductive pattern |
| Total patents | 242 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 21 |
| 2016 | 26 |
| 2017 | 20 |
| 2018 | 28 |
| 2019 | 24 |
| 2020 | 24 |
| 2021 | 21 |
| 2022 | 24 |
| 2023 | 17 |
| 2024 | 17 |
| 2025 | 17 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Jet ink composition, method and coated article
US-2017253755-A1 · Sep 7, 2017 · US
Jet ink composition, method and coated article
US-9683119-B2 · Jun 20, 2017 · US
Desmear treatment device and desmear treatment method
US-2017154791-A1 · Jun 1, 2017 · US
Desmear treatment device and desmear treatment method
US-2017156217-A1 · Jun 1, 2017 · US
Laser ablation for wirebonding surface on as-cast surface
US-2017135195-A1 · May 11, 2017 · US
Process of fabricating printed circuit board
US-9648723-B2 · May 9, 2017 · US
Manufacturing method of test socket and test method for semiconductor package
US-2017118846-A1 · Apr 27, 2017 · US
Methods for pre-cleaning conductive materials on a substrate
US-2017098540-A1 · Apr 6, 2017 · US
Compositions containing chlorofluoroolefins or fluoroolefins
US-2017073558-A1 · Mar 16, 2017 · US
Insertion loss reduction and increased bonding in a circuit apparatus
US-2017079133-A1 · Mar 16, 2017 · US
Compositions containing chlorofluoroolefins or fluoroolefins
US-9586071-B2 · Mar 7, 2017 · US
Weaved electrical components in a substrate package core
US-2017027062-A1 · Jan 26, 2017 · US
Cleaning solution, cleaning facility and method of cleaning mount substrate
US-2016376534-A1 · Dec 29, 2016 · US
Weaved electrical components in a substrate package core
US-9521751-B2 · Dec 13, 2016 · US
Pre-treatment process for electroless plating
US-2016348246-A1 · Dec 1, 2016 · US
Manufacturing of high resolution conductive patterns using organometallic ink and banded anilox rolls
US-9504164-B2 · Nov 22, 2016 · US
Desmear treatment device
US-2016330846-A1 · Nov 10, 2016 · US
Electrostatic adsorptive belt and method of manufacturing thereof, assembly, and conveyance system
US-9487365-B2 · Nov 8, 2016 · US
Device for automatically cleaning printed circuit board and the method using the same
US-9480167-B2 · Oct 25, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/26?
- CPC H05K3/26 is the Cooperative Patent Classification code for “Cleaning or polishing of the conductive pattern.”
- How many patents are filed under CPC H05K3/26 (Cleaning or polishing of the conductive pattern)?
- Our database includes 242 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/26 growing?
- Publication counts under this code: 17 in 2024 vs 17 in 2025 (latest complete years).