Wired circuit board, producing method thereof, and imaging device
US-2021298175-A1 · Sep 23, 2021 · US
using a lift-off resist pattern or a release layer pattern
using a lift-off resist pattern or a release layer pattern · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/048 |
| Official title | {using a lift-off resist pattern or a release layer pattern} |
| Display label | using a lift-off resist pattern or a release layer pattern |
| Total patents | 85 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 11 |
| 2016 | 10 |
| 2017 | 12 |
| 2018 | 5 |
| 2019 | 7 |
| 2020 | 11 |
| 2021 | 5 |
| 2022 | 3 |
| 2023 | 9 |
| 2024 | 4 |
| 2025 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of producing a wired circuit board
US-11058002-B2 · Jul 6, 2021 · US
Method of manufacturing circuit board with embedded conductive circuits
US-11058014-B1 · Jul 6, 2021 · US
Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board
US-10888003-B2 · Jan 5, 2021 · US
Preparation of electrical circuits by adhesive transfer
US-10849234-B2 · Nov 24, 2020 · US
Fiducials for laminate structures
US-2020288567-A1 · Sep 10, 2020 · US
Wired circuit board, producing method thereof, and imaging device
US-2020288575-A1 · Sep 10, 2020 · US
Circuit board interconnect decals
US-2020236788-A1 · Jul 23, 2020 · US
Nanowires-based transparent conductors
US-2020161017-A1 · May 21, 2020 · US
Electrical devices with electrodes on softening polymers and methods of manufacturing thereof
US-2020093007-A1 · Mar 19, 2020 · US
Nanowires-based transparent conductors
US-10580549-B2 · Mar 3, 2020 · US
Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board
US-2020053885-A1 · Feb 13, 2020 · US
Preparation of Electrical Circuits by Adhesive Transfer
US-2020029443-A1 · Jan 23, 2020 · US
Metallic microstructures with reduced-visibility and methods for producing same
US-10537028-B2 · Jan 14, 2020 · US
Circuit board interconnect decals
US-10531568-B1 · Jan 7, 2020 · US
Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board
US-10492308-B2 · Nov 26, 2019 · US
Electrical devices with electrodes on softening polymers and methods of manufacturing thereof
US-10485109-B2 · Nov 19, 2019 · US
Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board
US-2019261518-A1 · Aug 22, 2019 · US
Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board
US-10356915-B2 · Jul 16, 2019 · US
Molded interconnect device and method of making same
US-2019166698-A1 · May 30, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/048?
- CPC H05K3/048 is the Cooperative Patent Classification code for “using a lift-off resist pattern or a release layer pattern.”
- How many patents are filed under CPC H05K3/048 (using a lift-off resist pattern or a release layer pattern)?
- Our database includes 85 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/048 growing?
- Publication counts under this code: 4 in 2024 vs 8 in 2025 (latest complete years).