Copper foil with carrier, coreless support with wiring layer, and method for producing printed circuit board

Patent metadata

Field	Value
Publication number	US-10356915-B2
Application number	US-201716080442-A
Country	US
Kind code	B2
Filing date	Feb 21, 2017
Priority date	Feb 29, 2016
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.

First claim

The invention claimed is:

1. A copper foil provided with a carrier, comprising:
a carrier composed of glass or ceramics;
an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu;
a release layer disposed on the interlayer; and
an extremely-thin copper layer disposed on the release layer.

2. The copper foil provided with a carrier according to claim 1 , wherein the interlayer has a thickness of 5 to 1000 nm.

3. The copper foil provided with a carrier according to claim 1 , wherein the interlayer comprises;
an adhesive metal layer provided on the carrier and composed of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni; and
a release assisting layer disposed on the adhesive metal layer and composed of copper.

4. The copper foil provided with a carrier according to claim 3 , wherein the adhesive metal layer has a thickness of 5 to 500 nm.

5. The copper foil provided with a carrier according to claim 3 , wherein the release assisting layer has a thickness of 5 to 500 nm.

6. The copper foil provided with a carrier according to claim 1 , wherein the interlayer is an intermediate alloy layer composed of a copper alloy containing 1.0 atom % or more at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and 30 atom % or more copper.

7. The copper foil provided with a carrier according to claim 6 , wherein the intermediate alloy layer has a thickness of 5 to 500 nm.

8. The copper foil provided with a carrier according to claim 1 , wherein the release layer mainly contains carbon.

9. The copper foil provided with a carrier according to claim 1 , wherein the release layer has a thickness of 1 to 20 nm.

10. The copper foil provided with a carrier according to claim 1 , wherein the surface remote from the release layer of the extremely-thin copper layer has an arithmetic average roughness Ra of 1.0 to 100 nm, measured in accordance with JIS B 0601-2001.

11. The copper foil provided with a carrier according to claim 1 , wherein the surface adjacent to the interlayer of the carrier has an arithmetic average roughness Ra of 0.1 to 70 nm, measured in accordance with JIS B 0601-2001.

12. The copper foil provided with a carrier according claim 1 , wherein the carrier is composed of glass.

13. The copper foil provided with a carrier according to claim 1 , wherein at least the extremely-thin copper layer extends to end faces of the carrier and covers the end faces.

14. A method for manufacturing a coreless support provided with a wiring layer, comprising the steps of:
providing the copper foil provided with a carrier according to claim 1 as a support;
forming a photoresist layer with a predetermined pattern on the surface of the extremely-thin copper layer;
forming an electrolytic copper plating layer on the exposed surface of the extremely-thin copper layer;
peeling off the photoresist layer; and
removing an unnecessary portion of the extremely-thin copper layer by copper flash etching to prepare a coreless support provided with a wiring layer.

15. A method for manufacturing a printed wiring board, comprising the steps of:
manufacturing a coreless support provided with a wiring layer by the method according to claim 14 ;
forming a build-up layer on a surface having the wiring layer of the coreless support provided with a wiring layer to prepare a laminate with a build-up layer;
separating the laminate with a build-up layer at the release layer to prepare a multilayer wiring board including the build-up layer; and
processing the multilayer wiring board to prepare a printed wiring board.

Assignees

• Mitsui Mining & Smelting Co

Inventors

• Matsuura Yoshinori

Classifications

• H10W70/692

  Ceramics or glasses · CPC title

• C23C14/185

  by cathodic sputtering · CPC title

• C23C14/0605 Primary

  Carbon · CPC title

• C23C14/165

  by cathodic sputtering · CPC title

• C23C14/5873

  Removal of material · CPC title