Electrical devices with electrodes on softening polymers and methods of manufacturing thereof

Patent metadata

Field	Value
Publication number	US-10485109-B2
Application number	US-201715794863-A
Country	US
Kind code	B2
Filing date	Oct 26, 2017
Priority date	Oct 28, 2016
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

Flexible electrical devices comprising electrode layers on softening polymers and methods of manufacturing such devices, including lift-off processes for forming electrodes on softening polymers, processes for forming devices with a patterned double softening polymer layer, and solder reflow processes for forming electrical contacts on softening polymers.

First claim

The invention claimed is:

1. A method of manufacturing an electrical device, comprising:
forming a softening polymer layer with an electrode layer on a surface of the softening polymer layer;
forming a second softening polymer cover layer on the surface of the softening polymer layer, wherein:
a mechanical neutral plane of the electrical device is located at or above the surface of the softening polymer layer, and
an opening in the second softening polymer cover layer exposes a portion of a surface of the electrode layer, wherein the softening polymer layer and second softening polymer cover layer are composed of a softening polymer having a Young's modulus that decreases by more than 1 order of magnitude within an about 30° C. temperature increase.

2. The method of claim 1 , further including:
forming an inorganic hardmask layer on the second softening polymer cover layer;
removing, by a reactive ion etch process, a portion of the inorganic hardmask layer exposed through an opening in a patterned photoresist layer located on the inorganic hardmask layer to form an opening in the inorganic hardmask layer;
removing, by the reactive ion etch process, exposed portions of the cover layer underlying the opening in the inorganic hardmask layer to form the opening in the second softening polymer cover layer; and
removing the patterned photoresist layer and the inorganic hardmask layer.

3. The method of claim 2 , further including:
depositing a second electrode layer on the inorganic liftoff layer and the portion of the surface of the electrode layer.

4. The method of claim 3 , further including removing the inorganic hardmask layer by a horizontal liftoff etch that includes exposing the inorganic hardmask layer to an ester-based photoresist removing solvent or a potassium borate photo developing solution.

5. The method of claim 1 , further including exposing the surface of the softening polymer layer to a reactive ion etch treatment before forming the second softening polymer cover layer on the surface of the softening polymer layer, wherein
the surface of the softening polymer layer after the reactive ion etch treatment has an at least double a root mean squared surface roughness as compared to the surface before the reactive ion etch treatment, and
a thickness of the softening polymer layer after the reactive ion etch treatment is within about ±5 percent of the thickness of the softening polymer layer before the reactive ion etch treatment.

6. The method of claim 2 , wherein the removing, by the reactive ion etch process, of the exposed portions of the cover layer includes forming a plasma formed from a feed gas of oxygen at about 200 W biasing power and a pressure of about 200 mTorr.

7. The method of claim 1 , wherein the within about 30° C. temperature increase is from about 20° C. to about 50° C.

8. The method of claim 1 , wherein the within about 30° C. temperature increase is from about 20° C. to about 37° C.

Assignees

• Univ Texas

Inventors

• Modi Romil
• Reeder Jonathan
• Ellson Gregory T
• Voit Walter
• Imre Alexandra Joshi

Classifications

• H05K3/1216 Primary

  by screen printing or stencil printing · CPC title

• H10P76/403

  for lift-off processes · CPC title

• H05K3/346

  Solder materials or compositions specially adapted therefor · CPC title

• H05K3/1283

  After-treatment of the printed patterns, e.g. sintering or curing methods · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title