Method of manufacturing circuit board with embedded conductive circuits

Patent metadata

Field	Value
Publication number	US-11058014-B1
Application number	US-202017038282-A
Country	US
Kind code	B1
Filing date	Sep 30, 2020
Priority date	Sep 9, 2020
Publication date	Jul 6, 2021
Grant date	Jul 6, 2021

Abstract

A method for manufacturing a circuit board with embedded conductive circuits includes providing a first circuit substrate having a first support board and a first peelable film, providing a second circuit substrate having a second support board and a second peelable film, providing an insulating layer to obtain an intermediate body, pressing the intermediate body, and removing the first support board, the first peelable film, the second support board, and the second peelable film. The first circuit substrate includes a first circuit layer. The second circuit substrate includes a second circuit layer. The first circuit layer is electrically coupled to the second circuit layer through the insulating layer.

First claim

What is claimed is:

1. A method for manufacturing a circuit board with embedded conductive circuits, the method comprising:
providing a first support board, a first peelable film provided on one surface of the first support board;
forming a first conductive paste layer on the first peelable film;
etching the first conductive paste layer to form a first conductive circuit layer;
forming at least one first conductive pillar on the first conductive circuit layer, the first conductive pillar electrically coupled to the first conductive circuit layer, thereby obtaining a first circuit substrate;
providing a second support board, one surface of the second support board provided with a second peelable film;
forming a second conductive paste layer on the second peelable film;
etching the second conductive paste layer to form a second conductive circuit layer, thereby obtaining a second circuit substrate;
providing an insulating layer, and sequentially stacking the first circuit substrate, the insulating layer, and the second circuit substrate to obtain an intermediate body;
pressing the intermediate body so that the first conductive pillar passes through the insulating layer, the first conductive circuit layer and the second conductive circuit layer are electrically coupled through the first conductive pillar, and the first conductive circuit layer and the second conductive circuit layer embedded in the insulating layer; and
removing the first carrier board, the first peelable film, the second carrier board, and the second peelable film, thereby obtaining the circuit board.

2. The method of claim 1 , further comprising:
forming at least one second conductive pillar on the second conductive circuit layer, the second conductive pillar electrically coupled to the second conductive circuit layer; wherein:
the second conductive pillar passes through the insulating layer when the intermediate body is pressed and is electrically coupled to the first conductive pillar.

3. The method of claim 1 , wherein a method of forming the first conductive pillar comprises:
forming a dry film on the first peelable film, the dry film covering the first conductive circuit layer, the dry film defining at least one opening, and a portion of the first conductive circuit layer revealed through the at least one opening;
forming the first conductive pillar in the at least one opening; and
removing the dry film.

4. The method of claim 1 , wherein:
the first conductive paste layer and the second conductive paste layer both comprise 5-20 parts of a photosensitive resin polymer, 5-20 parts of a self-drying resin polymer, 0.5-5 parts of a photopolymerization initiator, 40-80 parts of conductive material, and 2-15 parts of a curing crosslinking agent.

5. The method of claim 4 , wherein:
the conductive material is at least one of silver particles, copper particles, graphene, and carbon nanotubes.

6. The method of claim 1 , wherein:
a thickness of the first conductive circuit layer is defined as d 1 , a height of the first conductive pillar is d 2 , a thickness of the second conductive circuit layer is d 3 , and a thickness of the insulating layer before pressing is D; and
d 1 , d 2 , d 3 , and D satisfy a relationship: D<(d 1 +d 2 +d 3 )<1.1 D.

7. The method of claim 2 , wherein:
a thickness of the first conductive circuit layer is defined as d 1 , a height of the first conductive pillar is d 2 , a thickness of the second conductive circuit layer is d 3 , a height of the second conductive pillar is d 4 , and a thickness of the insulating layer before pressing is D; and
d 1 , d 2 , d 3 , d 4 , and D satisfy a relationship: D<(d 1 +d 2 +d 3 +d 4 )<1.1 D.

8. The method of claim 1 , wherein the insulating layer is made of at least one of polypropylene, epoxy resin, and polyimide.

9. A method for manufacturing a circuit board, comprising:
providing a first circuit substrate, the first circuit substrate comprising a first support board, a first peelable film provided on one surface of the first support board, a first conductive circuit layer on a surface of the first peelable film, and at least one first conductive pillar formed on the first conductive circuit layer, the first conductive pillar electrically coupled to the first conductive circuit layer;
providing a second circuit substrate, the second circuit substrate comprising a second support board, a second peelable film provided on one surface of the second support board, and a second conductive circuit layer on a surface of the first peelable film;
providing an insulating layer, and sequentially stacking the first circuit substrate, the insulating layer, and the second circuit substrate to obtain an intermediate body;
pressing the intermediate body so that the first conductive pillar passes through the insulating layer, the first conductive circuit layer and the second conductive circuit layer are electrically coupled through the first conductive pillar, and the first conductive circuit layer and the second conductive circuit layer are embedded in the insulating layer; and
removing the first carrier board, the first peelable film, the second carrier board, and the second peelable film.

10. The method of claim 9 , wherein a method of forming the first circuit substrate comprises:
forming a first conductive paste layer on the first peelable film;
exposing and developing the first conductive paste layer to form a first conductive circuit layer; and
forming the at least one first conductive pillar on the first conductive circuit layer.

11. The method of claim 10 , wherein a method of forming the second circuit substrate comprises:
forming a second conductive paste layer on the second peelable film; and
exposing and developing the second conductive paste layer to form a second conductive circuit layer.

12. The method of claim 11 , wherein the method of forming the second circuit substrate further comprises:
forming at least one second conductive pillar on the second conductive circuit layer, the second conductive pillar electrically coupled to the second conductive circuit layer.

Assignees

• Avary Holding Shenzhen Co Ltd
• Hongqisheng Prec Electronics Qinhuangdao Co Ltd

Inventors

• Zhang Xiao-Yan
• Huang Han-Pei

Classifications

• H05K3/068

  Apparatus for etching printed circuits · CPC title

• H05K3/06 Primary

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• H05K2203/0514

  Photodevelopable thick film, e.g. conductive or insulating paste · CPC title

• H05K3/4647

  by applying an insulating layer around previously made via studs · CPC title

• H05K3/207 Primary

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title