Wiring substrate
US-2022223532-A1 · Jul 14, 2022 · US
by making a conductive layer having a relief pattern, followed by abrading of the raised portions
by making a conductive layer having a relief pattern, followed by abrading of the raised portions · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/045 |
| Official title | {by making a conductive layer having a relief pattern, followed by abrading of the raised portions} |
| Display label | by making a conductive layer having a relief pattern, followed by abrading of the raised portions |
| Total patents | 65 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 12 |
| 2017 | 10 |
| 2018 | 6 |
| 2019 | 9 |
| 2020 | 9 |
| 2021 | 6 |
| 2022 | 2 |
| 2023 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Milling of flex foil with two conductive layers from both sides
US-2022192028-A1 · Jun 16, 2022 · US
Dual conductor laminated substrate
US-11134575-B2 · Sep 28, 2021 · US
Pcb-pinout based packaged module and method for preparing pcb-pinout based packaged module
US-2021280998-A1 · Sep 9, 2021 · US
Plating solution and metal composite and method of manufacturing the same
US-2021222311-A1 · Jul 22, 2021 · US
Plating solution and metal composite and method of manufacturing the same
US-11021804-B2 · Jun 1, 2021 · US
Dual conductor laminated substrate
US-2021136930-A1 · May 6, 2021 · US
Dual Conductor Laminated Substrate
US-2021100109-A1 · Apr 1, 2021 · US
Manufacturing method for wiring board
US-10874021-B2 · Dec 22, 2020 · US
Double sided embedded trace substrate
US-2020388573-A1 · Dec 10, 2020 · US
Method for manufacturing wiring board
US-10827622-B2 · Nov 3, 2020 · US
Milling of Flex Foil with Two Conductive Layers From Both Sides
US-2020337154-A1 · Oct 22, 2020 · US
Milling of flex foil with two conductive layers from both sides
US-10709022-B1 · Jul 7, 2020 · US
Mounting component and electronic device
US-10672722-B2 · Jun 2, 2020 · US
Component carrier and method for manufacturing the same
US-10643949-B2 · May 5, 2020 · US
Substrate structure and method for manufacturing the same
US-10631406-B2 · Apr 21, 2020 · US
Embedded circuit patterning feature selective electroless
US-10586715-B2 · Mar 10, 2020 · US
Contacting Embedded Electronic Component Via Wiring Structure in a Component Carrier's Surface Portion With Homogeneous Ablation Properties
US-2019393155-A1 · Dec 26, 2019 · US
Chemical mechanical polishing composition and method of manufacturing circuit board
US-2019292408-A1 · Sep 26, 2019 · US
Chemical mechanical polishing composition and method of manufacturing circuit board
US-2019292409-A1 · Sep 26, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/045?
- CPC H05K3/045 is the Cooperative Patent Classification code for “by making a conductive layer having a relief pattern, followed by abrading of the raised portions.”
- How many patents are filed under CPC H05K3/045 (by making a conductive layer having a relief pattern, followed by abrading of the raised portions)?
- Our database includes 65 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/045 growing?
- Publication counts under this code: 2 in 2022 vs 5 in 2023 (latest complete years).