Plating solution and metal composite and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11021804-B2
Application number	US-201816176332-A
Country	US
Kind code	B2
Filing date	Oct 31, 2018
Priority date	Jan 26, 2018
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.

First claim

What is claimed is:

1. A plating solution comprising a metal salt, a hydrophilic fullerene, and water, and a metal-fullerene composite that is a reaction product of the metal salt and the hydrophilic fullerene represented by C x (OH) y , wherein x is 60, 70, 74, 76, or 78, and an average value of y is about 2 to about 44, a particle diameter of the metal-fullerene composite measured through dynamic light scattering being less than or equal to about 10 nanometers.

2. The plating solution of claim 1 , wherein the plating solution has a pH of 3.5 or less.

3. The plating solution of claim 1 , wherein the hydrophilic fullerene is present in an amount of about 10 to about 100 parts by weight based on 100 parts by weight of the metal salt.

4. The plating solution of claim 1 , wherein the hydrophilic fullerene represented by C x (OH) y , wherein x is 60, 70, 74, 76, or 78, and the average value of y is about 2 to about 44 is chemically bonded with a metal cation of the metal salt in the metal-fullerene composite.

5. A method of forming a metal composite material comprising
preparing the plating solution of claim 1 ,
disposing a substrate comprising a metal layer or a metal plate and an opposed electrode in the plating solution, and
plating a metal composite material comprising a hydrophilic fullerene on the metal layer or the metal plate by flowing a current between the metal layer or the metal plate and the opposed electrode to form the metal composite material.

6. The method of claim 5 , wherein the plating of the metal composite material is performed at a current density ranging from about 0.1 amperes per square meter to about 1.0 amperes per square meter.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Takai Kenji
• Lee Sang Eui
• Minami Daiki

Classifications

• C01B32/156 Primary

  After-treatment · CPC title

• B82Y30/00

  Nanotechnology for materials or surface science, e.g. nanocomposites · CPC title

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title

• C25D3/38 Primary

  of copper · CPC title

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title