Embedded circuit patterning feature selective electroless

Patent metadata

Field	Value
Publication number	US-10586715-B2
Application number	US-201715588500-A
Country	US
Kind code	B2
Filing date	May 5, 2017
Priority date	Mar 28, 2014
Publication date	Mar 10, 2020
Grant date	Mar 10, 2020

Abstract

Embodiments describe the selective electroless plating of dielectric layers. According to an embodiment, a dielectric layer is patterned to form one or more patterned surfaces. A seed layer is then selectively formed along the patterned surfaces of the dielectric layer. An electroless plating process is used to deposit metal only on the patterned surfaces of the dielectric layer. According to an embodiment, the dielectric layer is doped with an activator precursor. Laser assisted local activation is performed on the patterned surfaces of the dielectric layer in order to selectively form a seed layer only on the patterned surfaces of the dielectric layer by reducing the activator precursor to an oxidation state of zero. According to an additional embodiment, a seed layer is selectively formed on the patterned surfaces of the dielectric layer with a colloidal or ionic seeding solution.

First claim

What is claimed is:

1. A method for metallizing a dielectric layer, comprising:
patterning the dielectric layer to form one or more patterned surfaces on the dielectric layer, wherein the patterning process increases the surface potential of the patterned surfaces such that it has a net positive charge;
applying a surface treatment to the dielectric layer that further increases the surface potential of the patterned surfaces relative to unpatterned surfaces of the dielectric layer;
selectively forming a seed layer only on the one or more patterned surfaces of the dielectric layer by dipping the dielectric layer in a colloidal seeding solution, wherein the colloids are negatively charged and are deposited on the positively charged patterned surfaces; and
exposing the dielectric layer to an electroless plating bath comprising metal ions and a reducing agent, wherein the seed layer is a catalyst that allows the reducing agent to reduce the metal ions, thereby depositing the metal ions on surfaces of the dielectric layer where the seed layer is formed.

2. The method of claim 1 , wherein the surface treatment comprises one or more of, deionized water, ethanol, acetone, H 2 SO 4 , H 2 NO 3 , or Na-dodecylbenzene sulfonate (SDBS).

3. The method of claim 1 , wherein the surface treatment includes dipping the dielectric layer into a bath that includes the surface treatment solution.

4. The method of claim 1 , wherein the surface treatment includes rinsing the surface treatment solution over the surface of the dielectric layer.

5. The method of claim 1 , wherein the surface potential of the patterned surfaces of the dielectric layer is increased by 100% or more after the surface treatment.

6. The method of claim 1 , wherein the patterned surfaces of the dielectric layer have a surface potential between approximately 4 V and 10 V, and wherein the unpatterned surfaces of the dielectric layer have a surface potential between approximately 1 V and 2 V.

7. The method of claim 1 , wherein the method further comprises cleaning the surface of the dielectric layer with ultra-sonic cleaning prior to exposing the dielectric layer to an electroless plating bath.

8. The method of claim 1 , wherein the seed layer is a non-continuous layer.

9. The method of claim 1 , wherein the dielectric layer is laminated or spun on over an existing layer.

10. The method of claim 1 , wherein the colloidal seeding solution includes a mixture of SnCl 2 and PdCl 2 .

11. The method of claim 10 , wherein the colloids have an average diameter between approximately 10 nm and 20 nm.

Assignees

• Intel Corp

Inventors

• Li Yonggang Yong
• Dhar Aritra
• Seneviratne Dilan
• Williams Jon M

Classifications

• H05K2203/072

  Electroless plating, e.g. finish plating or initial plating · CPC title

• C23C18/1612

  through irradiation means · CPC title

• C23C18/38

  Coating with copper · CPC title

• H05K3/045

  by making a conductive layer having a relief pattern, followed by abrading of the raised portions · CPC title

• H05K2203/107

  Using laser light · CPC title