Method for manufacturing wiring board

Patent metadata

Field	Value
Publication number	US-10827622-B2
Application number	US-201615266323-A
Country	US
Kind code	B2
Filing date	Sep 15, 2016
Priority date	Sep 17, 2015
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

Wiring boards, including an embedded type wiring boards and flexible wiring boards, may be produce by: (1) preparing a wiring layer-attached base including a base and a wiring layer provided on at least one surface of the base, (2) laminating an adhesive sheet including (i) a thermosetting resin composition layer and (ii) a resin film layer on the wiring layer-attached base so that the wiring layer will be embedded in (i) the thermosetting resin composition layer and performing thermal curing to form an insulating layer, (3) forming via holes in the insulating layer, (4) forming a conductor layer, and (5) removing the base.

First claim

The invention claimed is:

1. A method for manufacturing a wiring board, said method comprising (a) to (e) in this order:
(a) preparing a wiring layer-attached base comprising a base and a wiring layer provided on at least one surface of said base;
(b) laminating an adhesive sheet comprising (i) a thermosetting resin composition layer and (ii) a resin film layer on said wiring layer-attached base so that said wiring layer will be embedded in (i) said thermosetting resin composition layer and performing thermal curing to form an insulating layer;
(c) forming a via hole in said insulating layer;
(d) forming a conductor layer on a surface of said insulating layer; and
(e) removing said base;
wherein the resin film layer consists of at least one member selected from the group consisting of polyimide, polyethylene terephthalate, polyethylene naphthalate, a liquid crystal polymer, polyphenylene sulfide, polyether ether ketone, polybenzimidazole, aramid, polyamideimide, and polyether imide; and
the thermosetting resin composition layer comprises at least one epoxy resin, at least one curing agent and at least one inorganic filler,
wherein, when a non-volatile component in said thermosetting resin composition layer is defined as 100% by mass, said inorganic filler is present in an amount of from 20% to 62% by mass.

2. The method according to claim 1 , wherein said adhesive sheet further comprises (iii) metallic foil or a thermosetting resin composition layer and comprises (i) said thermosetting resin composition layer, (ii) said resin film layer, and (iii) said metallic foil or the thermosetting resin composition layer in this order.

3. The method according to claim 1 , wherein forming said via hole is performed by laser irradiation.

4. The method according to claim 1 , further comprising performing a roughening treatment prior to forming said conductor layer.

5. The method according to claim 1 , wherein said wiring board is a flexible wiring board.

6. The method according to claim 1 , wherein said adhesive sheet exhibits elongation at break after thermal curing of 2% or more.

7. The method according to claim 1 , wherein a surface of (ii) said resin film layer is subjected to corona treatment, plasma treatment, or UV treatment.

8. The method according to claim 1 , wherein said metallic foil is copper foil.

9. The method according to claim 1 , wherein a minimum pitch of a wiring pattern is 40 μm or less.

10. The method according to claim 1 , wherein in (d) the conductor layer is formed on a surface of said insulating layer, wherein said surface is in said via hole.

Assignees

• Ajinomoto Kk

Inventors

• Nakamura Shigeo
• Fujiwara Chihiro

Classifications

• H10W70/05 Primary

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H05K2203/097

  Corona discharge · CPC title

• H05K2201/0355

  Metal foils · CPC title

• H05K3/0026

  by laser ablation · CPC title

• H05K2203/095

  Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes · CPC title