Circuit board and manufacturing method thereof
US-11212922-B2 · Dec 28, 2021 · US
the conductive material being removed mechanically, e.g. by punching
the conductive material being removed mechanically, e.g. by punching · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/04 |
| Official title | the conductive material being removed mechanically, e.g. by punching |
| Display label | the conductive material being removed mechanically, e.g. by punching |
| Total patents | 91 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 9 |
| 2017 | 12 |
| 2018 | 8 |
| 2019 | 7 |
| 2020 | 9 |
| 2021 | 13 |
| 2022 | 8 |
| 2023 | 8 |
| 2024 | 2 |
| 2025 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Display substrate, method for manufacturing the same and display device
US-2021267053-A1 · Aug 26, 2021 · US
Circuit board and manufacturing method thereof
US-2021235590-A1 · Jul 29, 2021 · US
Resistive pcb traces for improved stability
US-2021153353-A1 · May 20, 2021 · US
Dual conductor laminated substrate
US-2021136930-A1 · May 6, 2021 · US
Dual Conductor Laminated Substrate
US-2021100109-A1 · Apr 1, 2021 · US
Manufacturing method of circuit substrate
US-2021037657-A1 · Feb 4, 2021 · US
Manufacturing method for wiring board
US-10874021-B2 · Dec 22, 2020 · US
SNAP-RF interconnections
US-10849219-B2 · Nov 24, 2020 · US
Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line
US-10826147-B2 · Nov 3, 2020 · US
Milling of Flex Foil with Two Conductive Layers From Both Sides
US-2020337154-A1 · Oct 22, 2020 · US
Milling of flex foil with two conductive layers from both sides
US-10709022-B1 · Jul 7, 2020 · US
Method for manufacturing flexible circuit board
US-2020178402-A1 · Jun 4, 2020 · US
Method of manufacturing a circuit board by punching
US-10651320-B2 · May 12, 2020 · US
Substrate structure and method for manufacturing the same
US-10631406-B2 · Apr 21, 2020 · US
Frame assembly and method for manufacturing same
US-2020014005-A1 · Jan 9, 2020 · US
Driving substrate, manufacturing process, and micro-LED array light-emitting backlight module
US-10512159-B2 · Dec 17, 2019 · US
Driving substrate, manufacturing process, and micro-led array light-emitting backlight module
US-2019327825-A1 · Oct 24, 2019 · US
Method of manufacturing a circuit board by punching
US-2019288127-A1 · Sep 19, 2019 · US
Snap-rf interconnections
US-2019269007-A1 · Aug 29, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/04?
- CPC H05K3/04 is the Cooperative Patent Classification code for “the conductive material being removed mechanically, e.g. by punching.”
- How many patents are filed under CPC H05K3/04 (the conductive material being removed mechanically, e.g. by punching)?
- Our database includes 91 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/04 growing?
- Publication counts under this code: 2 in 2024 vs 7 in 2025 (latest complete years).