Pcb embedded radiator antenna with exposed tuning stub
US-2017117620-A1 · Apr 27, 2017 · US
SNAP-RF interconnections
US10849219B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10849219-B2 |
| Application number | US-201916287240-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 27, 2019 |
| Priority date | Feb 28, 2018 |
| Publication date | Nov 24, 2020 |
| Grant date | Nov 24, 2020 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A radio frequency connector, comprising: a substrate; a first ground plane disposed upon the substrate; a signal conductor having a first contact point, the first contact point being configured to be electrically connected to a second contact point; a first ground boundary configured to be electrically connected to a second ground boundary, the first ground boundary being formed as an electrically continuous conductor within the substrate; an alignment element configured to align the first and second contact points; and a coupling element configured to provide contact between the first and second contact points, wherein the coupling element is a magnetic element. 2. The radio frequency connector of claim 1 , wherein the coupling element is further configured to align the first and second contact points. 3. A radio frequency interconnect structure, comprising: a first connector including a first substrate, a first ground plane disposed upon the first substrate, a first signal conductor having a first contact point, and a first ground boundary formed as an electrically continuous conductor within the first substrate; a second connector including a second substrate, a second ground plane disposed upon the second substrate, a second signal conductor having a second contact point configured to be electrically connected to the first contact point of the first connector, and a second ground boundary formed as an electrically continuous conductor within the second substrate, the second ground boundary being configured to be electrically connected to the first ground boundary; and a coupling element configured to provide contact between the first contact point of the first connector and the second contact point of the second connector, wherein the coupling element is a magnetic element. 4. The radio frequency interconnect structure of claim 3 , wherein the coupling element is further configured to align the first contact point of the first connector and the second contact point of the second connector.
Assignees
Inventors
Classifications
Parallel layout · CPC title
Stacked PCBs, i.e. having neither an empty space nor mounted components in between · CPC title
characterized by laminating only or mainly similar double-sided circuit boards · CPC title
Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title
parallel to each other (H05K3/361 takes precedence) · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10849219B2 cover?
- A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electricall…
- Who is the assignee on this patent?
- Raytheon Co
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0221. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 24 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).