Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line

Patent metadata

Field	Value
Publication number	US-10826147-B2
Application number	US-201816183169-A
Country	US
Kind code	B2
Filing date	Nov 7, 2018
Priority date	Nov 10, 2017
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

Circuits and methods include transmission lines formed from a conductive cladding on a substrate surface. The transmission line includes additional reference conductors positioned co-planar on the surface, including a gap between the transmission line and each of the reference conductors. The transmission line and the reference conductors are at least partially encapsulated (e.g., sandwiched) between two substrates. Isolation boundaries may be included as ground planes, e.g., above and below the transmission line, on opposing surfaces of the substrates, and Faraday walls, e.g., vertically, through the substrates. Current densities generated by various electromagnetic signals are distributed among the transmission line and the reference conductors (as a tri-conductor arrangement), and may be partially further distributed to the isolation (ground) boundaries.

First claim

What is claimed is:

1. A radio frequency circuit, comprising:
a first dielectric substrate having a first surface;
a second dielectric substrate having a second surface, the first and second dielectric substrates being positioned relative to one another such that the second surface faces the first surface;
a transmission line formed from a conductive cladding disposed upon the first surface, the transmission line being at least partially encapsulated between the first dielectric substrate and the second dielectric substrate;
a pair of reference conductors, each of the pair of reference conductors positioned adjacent to and co-planar with the transmission line and spaced such that there is a respective gap between each of the pair of reference conductors and the transmission line, each of the pair of reference conductors disposed upon the first surface or the second surface and being at least partially encapsulated between the first dielectric substrate and the second dielectric substrate;
a first ground plane provided on a third surface of the first dielectric substrate, the third surface being an opposing and substantially parallel surface to the first surface;
a second ground plane provided on a fourth surface of the second dielectric substrate, the fourth surface being an opposing and substantially parallel surface to the second surface;
a trench formed through the first dielectric substrate and the second dielectric substrate, the trench extending between and being substantially perpendicular to the first ground plane and the second ground plane; and
a conductive material deposited in the trench, the conductive material arranged to be in electrical contact with each of the first ground plane and the second ground plane.

2. The radio frequency circuit of claim 1 wherein the pair of reference conductors is formed from the conductive cladding disposed upon the first substrate.

3. The radio frequency circuit of claim 1 wherein the first surface of the first dielectric substrate constitutes a bottom surface, the second surface of the second dielectric substrate constitutes a top surface, the third surface of the first dielectric substrate constitutes a top surface, and the fourth surface of the second dielectric substrate constitutes a bottom surface, each of the pair of ground planes being positioned substantially parallel to the co-planar arrangement of the transmission line and the pair of reference conductors.

4. The radio frequency circuit of claim 3 wherein the conductive material deposited in the trench is configured to form a pair of boundary walls disposed substantially perpendicular to the first and second ground planes and the co-planar arrangement of the transmission line and the pair of reference conductors, the pair of boundary walls being electrically continuous and in electrical contact with the first and second ground planes such that the pair of boundary walls and the first and second ground planes form a conductive electromagnetic boundary around the transmission line in at least two dimensions.

5. The radio frequency circuit of claim 4 wherein the pair of boundary walls is in electrical contact with the pair of reference conductors.

6. The radio frequency circuit of claim 4 further comprising an electrical conductor disposed through a hole in at least one of the first dielectric substrate and the second dielectric substrate, the electrical conductor being in electrical contact with the transmission line.

7. The radio frequency circuit of claim 4 wherein the transmission line produces 1.2 decibels or less of insertion loss per inch at 70 GHz.

8. A transmission line assembly comprising:
a pair of dielectric substrates;
an electrical conductor at least partially embedded between the pair of dielectric substrates;
a pair of reference conductors at least partially embedded between the pair of dielectric substrates and positioned to be co-planar with the electrical conductor and spaced apart from the electrical conductor by a respective gap;
a pair of ground planes, each of the pair of ground planes disposed adjacent to an outer surface of a respective one of the pair of dielectric substrates, each of the pair of ground planes being substantially parallel to each other and to the co-planar arrangement of the electrical conductor and the pair of reference conductors;
a pair of electromagnetic boundaries formed of an electrically continuous conductor disposed through the pair of dielectric substrates, substantially extending between the pair of ground planes and in electrical communication with the pair of ground planes, wherein the pair of electromagnetic boundaries is in electrical communication with the pair of reference conductors; and
a first electrical component electrically coupled to a first end of the electrical conductor and a second electrical component electrically coupled to a second end of the electrical conductor, the electrical conductor being configured to convey an electromagnetic signal of greater than 24 GHz between the first electrical component and the second electrical component.

9. The transmission line assembly of claim 8 wherein the electrical conductor is a first electrical conductor and further comprising a second electrical conductor in electrical communication with the first electrical conductor, the second electrical conductor disposed through at least one of the pair of dielectric substrates.

10. A method of fabricating an electromagnetic circuit, the method comprising:
providing a first dielectric substrate having a conductive cladding disposed upon a first surface thereof;
machining the conductive cladding to remove a portion of the conductive cladding to form a transmission line, the removed portion forming a respective gap between the transmission line and a remaining portion of the conductive cladding, at least some of the remaining portion of the conductive cladding forming a pair of reference conductors on either side of, and co-planar with, the transmission line;
providing a second dielectric substrate having a second surface and positioning the second dielectric substrate so that the second surface faces the first surface, thereby at least partially encapsulating the transmission line and the pair of reference conductors between the first dielectric substrate and the second dielectric substrate;
providing the first dielectric substrate with a first ground plane disposed on a third surface, the third surface being an opposing and substantially parallel surface to the first surface, and providing the second dielectric substrate with a second ground plane disposed on a fourth surface, the fourth surface being an opposing and substantially parallel surface to the second surface, each of the first ground plane and the second ground plane being substantially parallel to each other and to the co-planar arrangement of the transmission line and the pair of reference conductors;
machining the first dielectric substrate and the second dielectric substrate to form a trench through the first dielectric substrate and the second dielectric substrate, the trench extending between and being substantially perpendicular to the first ground plane and the second ground plane; and
filling the trench with a conductive material, the conductive material arranged to be in electrical contact with each of the first ground plane and the second ground plane.

11. The method of claim 10 further comprising conveying to the transmission line an electromagnetic signal having a frequency in the range of 24 GHZ to 75 GHz.

12. The method of claim 10 wherein the conductive material is also arranged to be in electrical contact with the pair of ref

Assignees

• Raytheon Co

Inventors

• Sikina Thomas V
• Haven John P
• Benedict James E

Classifications

• H05K2201/09854

  Hole or via having special cross-section, e.g. elliptical · CPC title

• H05K1/0224

  Patterned shielding planes, ground planes or power planes (H05K1/0253 takes precedence) · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H01P3/085 Primary

  Triplate lines · CPC title

• H05K3/107

  by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence) · CPC title