Driving substrate, manufacturing process, and micro-LED array light-emitting backlight module

US10512159B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10512159-B2
Application numberUS-201816300045-A
CountryUS
Kind codeB2
Filing dateSep 14, 2018
Priority dateApr 24, 2018
Publication dateDec 17, 2019
Grant dateDec 17, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present disclosure relates to a driving substrate, a manufacturing method, and a micro-LED array substrate light-emitting backlight module. The driving substrate includes a first metal layer, a first high-reflection layer, and a second metal layer stacked in a top-down sequence. The driving substrate, the manufacturing method, and the micro-LED array light emitting backlight module of the present disclosure solve the loss of reflectivity issue caused by the edge forbidden area of the electrode welding pad edge forbidden region. At the same time, the limited reflectivity of traditional coated high-reflective layers (such as white oil) may also be enhanced.

First claim

Opening claim text (preview).

What is claimed is: 1. A driving substrate, comprising: a first metal layer, a first high-reflection layer, and a second metal layer stacked in a top-down sequence; wherein the driving substrate further comprises a second high-reflection layer arranged above the second metal layer; wherein the electrode welding pad of the driving substrate is exposed by the second high-reflection layer. 2. The driving substrate as claimed in claim 1 , wherein the driving substrate further comprises an insulation supporting layer arranged between the first metal layer and the first high-reflection layer. 3. The driving substrate as claimed in claim 2 , wherein the insulation supporting layer is a polyimide (PI) layer. 4. The driving substrate as claimed in claim 1 , wherein the first metal layer and the second metal layer respectively form a metal wire pattern. 5. The driving substrate as claimed in claim 1 , wherein the first high-reflection layer is made by high-reflection organic material or a high-reflection thin layer comprising multiple inorganic thin films. 6. The driving substrate as claimed in claim 1 , wherein the second high-reflection layer is a high high-reflection thin layer comprising high-reflection organic material. 7. A micro-LED array light-emitting backlight module, comprising: a driving substrate, a micro-LED array, a fluorescent film, a diffusion sheet, and a brightness enhancing film being stacked sequentially from bottom to top, wherein the driving substrate is the driving substrate as claimed in claim 1 . 8. A manufacturing method of driving substrates, comprising: forming a first metal layer; forming an insulation supporting layer; forming a first high-reflection layer; forming a second high-reflection layer; respectively etching the first metal layer and the second metal layer to form metal wire patterns; forming a second high-reflection layer; and removing the second high-reflection layer on a surface of a second electrode pad.

Assignees

Inventors

Classifications

  • Use of materials for the {conductive, e.g. } metallic pattern · CPC title

  • Light emitting diode [LED] · CPC title

  • Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics · CPC title

  • Polyimide · CPC title

  • with LEDs · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10512159B2 cover?
The present disclosure relates to a driving substrate, a manufacturing method, and a micro-LED array substrate light-emitting backlight module. The driving substrate includes a first metal layer, a first high-reflection layer, and a second metal layer stacked in a top-down sequence. The driving substrate, the manufacturing method, and the micro-LED array light emitting backlight module of the p…
Who is the assignee on this patent?
Wuhan China Star Optoelectronics Technology Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K1/028. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).